Search Results - "Microelectronics and reliability" :: K.UTB vyhledávací portál

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Research on the relative independence of failure mechanisms for mitigating passing word line induced row hammering

by Chen, Shanyong, Luo, Hanqing, Liang, Liping
Published in Microelectronics and reliability (01.08.2025)

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Modeling total ionizing dose radiation effects in p-type polycrystalline silicon thin film transistors

by Peng, Shaoman, Shan, Haoliang, Yang, Ruifan, Liu, Yuan, Deng, Wanling
Published in Microelectronics and reliability (01.08.2025)

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Ultra-fast recovery transients in GaN MIS-HEMT submitted to OFF-state stress

by Cavaliere, A., Modolo, N., De Santi, C., Meneghesso, G., Zanoni, E., Meneghini, M.
Published in Microelectronics and reliability (01.08.2025)

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Evaluation with FEM analysis of peak case non-rupture current for power devices working at very high current

by Spaggiari, D., Cova, P., Portesine, F., Aschero, M., Delmonte, N.
Published in Microelectronics and reliability (01.08.2025)

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Fatigue damage of automotive LEDs: Experimental approach and thermomechanical model

by Maarouf, Khalil, Roucoules, Christine, Akrou, Kouadio Joseph, Sao-Joao, Sergio, Klöcker, Helmut
Published in Microelectronics and reliability (01.08.2025)

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Effect of load sequence interaction for low ∆Tj's on the reliability of bonded aluminum wires in IGBTs

by Halouani, A., Khatir, Z., Lallemand, R., Ibrahim, A., Ingrosso, D.
Published in Microelectronics and reliability (01.08.2025)

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Disentangling bulk and interfacial factors in solder joint reliability of fine pitch packages

by Jang, You-Cheol
Published in Microelectronics and reliability (01.08.2025)

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Development challenges of a one-sided GaN-based high-current density buck converter through multiphysics optimization for electric vehicle applications

by Belguith, M., Eloued, S., Kadi, M., Ben Hadj Slama, J.
Published in Microelectronics and reliability (01.08.2025)

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Effect of load sequence interaction for low ∆T's on the reliability of bonded aluminum wires in IGBTs

by Halouani, A., Khatir, Z., Lallemand, R., Ibrahim, A., Ingrosso, D.
Published in Microelectronics and reliability (01.08.2025)

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Performance characterization of lithium-ion battery and aging under constant stress conditions at low temperature

by Rafik, O., Capitaine, A., Briat, O., Vinassa, J.-M.
Published in Microelectronics and reliability (01.08.2025)

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Vibration characteristics and lead stress optimization for printed circuit board with PQFP under random loads

by Hu, Bin, Sun, Yunyun, Wu, Shijing
Published in Microelectronics and reliability (01.08.2025)

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Effective number of accelerated thermal cycles (ATCs) for accurate prediction of damage and fatigue life of solder joints in IGBT power module

by Nebo, Sunday E., Amalu, Emeka H., Hughes, David J.
Published in Microelectronics and reliability (01.08.2025)

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Aging modelling of Li-ion battery systems based on accelerated tests

by Toscani, A., Stighezza, M., Simonazzi, M., Delmonte, N., Cova, P., Bianchi, V., De Munari, I.
Published in Microelectronics and reliability (01.08.2025)

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Impact of constant and pulsed active balancing current patterns on the aging of lithium-ion batteries

by Hussain, M.A., Soldati, A., Sozzi, G.
Published in Microelectronics and reliability (01.08.2025)

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Analytical modeling of CV and I-V characteristics in p-GaN gate HEMTs based on the unified 2DEG density expression

by Zhang, Lili, Yin, Yanan, Qiu, Yiwu, Wang, Tao, Zhang, Pingwei, Zhou, Xinjie
Published in Microelectronics and reliability (01.08.2025)

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The impact of 10 MeV electron irradiation on switching characteristics of SiC MOSFET devices

by Fu, Xianghe, Guo, Shuwen, Peng, Wenbo, Zhao, Xiaolong, Zhu, Quanzhe, He, Yongning
Published in Microelectronics and reliability (01.08.2025)

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Experiments and root cause analysis for active-precharge hammering fault in DDR3 SDRAM under 3× nm technology

by Park, Kyungbae, Lim, Chulseung, Yun, Donghyuk, Baeg, Sanghyeon
Published in Microelectronics and reliability (01.02.2016)

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Positive and negative charge trapping GaN HEMTs: Interplay between thermal emission and transport-limited processes

by Nardo, A., De Santi, C., Koller, C., Ostermaier, C., Daumiller, I., Meneghesso, G., Zanoni, E., Meneghini, M.
Published in Microelectronics and reliability (01.11.2021)

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Inkjet-printed HF antenna made on PET substrate

by Tomaszewski, Grzegorz, Jankowski-Mihułowicz, Piotr, Potencki, Jerzy, Pietrikova, Alena, Lukacs, Peter
Published in Microelectronics and reliability (01.02.2022)

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Utilizing CNN to predict homogeneous thermo-mechanical properties of conductive layers for reliability numerical analysis in electronics

by Wan, Guoshun, Dong, Qi, Sun, Xiaochen, Zheng, Hao, Cheng, Mengxuan, Qiao, Wen, Jia, Yuxi
Published in Microelectronics and reliability (01.06.2024)

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