Eye Diagram Analysis with Deep Neural Networks for Signal Integrity Applications
Weiyang, Miao, Tan, Chuan Seng, Rotaru, Mihai D.
Published in 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC) (07.12.2022)
Published in 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC) (07.12.2022)
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Conference Proceeding
Time Evolution Study of Two-Step Plasma-Treated Copper-Copper Direct Bonding in Ambient
Hu, Liangxing, Lim, Yu Dian, Zhao, Peng, Zhong Lim, Michael Joo, Miao, Weiyang, Dinh, Van Quy, Ju, Xin, Tan, Chuan Seng
Published in 2023 International Conference on Electronics Packaging (ICEP) (19.04.2023)
Published in 2023 International Conference on Electronics Packaging (ICEP) (19.04.2023)
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Conference Proceeding
Plasma-Activated Cu-Cu and Al-Al Direct Bonding for Electronics Packaging
Hu, Liangxing, Goh, Simon Chun Kiat, Lim, Yu Dian, Zhao, Peng, Lim, Michael Joo Zhong, Miao, Weiyang, Dinh, Van Quy, Tan, Chuan Seng
Published in 2022 17th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) (26.10.2022)
Published in 2022 17th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) (26.10.2022)
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Conference Proceeding
Reliability Study of Two-Step Plasma-Activated Copper-Copper Direct Bonding in Ambient
Hu, Liangxing, Lim, Yu Dian, Zhong Lim, Michael Joo, Miao, Weiyang, Dinh, Van Quy, Xie, Zhen, Chen, Qimiao, Ju, Xin, Tan, Chuan Seng
Published in 2023 24th International Conference on Electronic Packaging Technology (ICEPT) (08.08.2023)
Published in 2023 24th International Conference on Electronic Packaging Technology (ICEPT) (08.08.2023)
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Conference Proceeding
Comparative Study of Die-Attach Materials for LED Die Bonding
Hu, Liangxing, Bao, Shuyu, Wang, Yue, Kiat Goh, Simon Chun, Lim, Yu Dian, Zhao, Peng, Lim, Michael Joo Zhong, Miao, Weiyang, Dinh, Van Quy, Tan, Sai Choo, Chew, Kai Hwa, Tan, Chuan Seng
Published in 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC) (07.12.2022)
Published in 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC) (07.12.2022)
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Conference Proceeding
Infrared light supplementing lamp panel with heat dissipation effect
CHEN LONG, WANG YONGJIAN, CHEN YILI, CHEN CHUNYING, MIAO WEIYANG, GUO FAN
Year of Publication 18.06.2024
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Year of Publication 18.06.2024
Patent
Stroboscopic light supplement lamp
CHEN LONG, WANG YONGJIAN, CHEN YILI, CHEN CHUNYING, MIAO WEIYANG, GUO FAN
Year of Publication 31.05.2024
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Year of Publication 31.05.2024
Patent
Light supplementing lamp with adjustable irradiation angle
CHEN LONG, WANG YONGJIAN, CHEN YILI, CHEN CHUNYING, MIAO WEIYANG, GUO FAN
Year of Publication 28.05.2024
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Year of Publication 28.05.2024
Patent
Anti-mosquito infrared light supplementing lamp panel
CHEN LONG, WANG YONGJIAN, CHEN YILI, CHEN CHUNYING, MIAO WEIYANG, GUO FAN
Year of Publication 28.05.2024
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Year of Publication 28.05.2024
Patent
Electronic camera with protection structure
CHEN LONG, WANG YONGJIAN, CHEN YILI, CHEN CHUNYING, MIAO WEIYANG, GUO FAN
Year of Publication 30.04.2024
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Year of Publication 30.04.2024
Patent
Infrared light supplement lamp for railway vehicle
CHEN LONG, WANG YONGJIAN, CHEN YILI, CHEN CHUNYING, MIAO WEIYANG, GUO FAN
Year of Publication 19.04.2024
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Year of Publication 19.04.2024
Patent
Traffic velocimeter with height adjusting structure
CHEN LONG, WANG YONGJIAN, CHEN YILI, CHEN CHUNYING, MIAO WEIYANG, GUO FAN
Year of Publication 19.04.2024
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Year of Publication 19.04.2024
Patent
Automobile antenna for vehicle-road collaborative navigation
CHEN LONG, WANG YONGJIAN, CHEN YILI, CHEN CHUNYING, MIAO WEIYANG, GUO FAN
Year of Publication 19.04.2024
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Year of Publication 19.04.2024
Patent
Multifunctional light supplementing lamp device
CHEN LONG, WANG YONGJIAN, CHEN YILI, CHEN CHUNYING, MIAO WEIYANG, GUO FAN
Year of Publication 16.04.2024
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Year of Publication 16.04.2024
Patent