Double-sided cooling for high power IGBT modules using flip chip technology
Gillot, C., Schaeffer, C., Ferret, R., Massit, C., Meysene
Published in Conference Record of the 2000 IEEE Industry Applications Conference. Thirty-Fifth IAS Annual Meeting and World Conference on Industrial Applications of Electrical Energy (Cat. No.00CH37129) (2000)
Published in Conference Record of the 2000 IEEE Industry Applications Conference. Thirty-Fifth IAS Annual Meeting and World Conference on Industrial Applications of Electrical Energy (Cat. No.00CH37129) (2000)
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