Residual stresses in microelectronics induced by thermoset packaging materials during cure
Meuwissen, Marcel H.H., de Boer, Hedzer A., Steijvers, Henk L.A.H., Schreurs, Piet J.G., Geers, Marc G.D.
Published in Microelectronics and reliability (01.12.2004)
Published in Microelectronics and reliability (01.12.2004)
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Journal Article
Conference Proceeding
Technical feasibility study on polycarbonate solar panels
Hackmann, Martijn M., Meuwissen, Marcel H.H., Bots, Tom L., Buijs, Jan A.H.M., Broek, Kees M., Kinderman, Ronald, Tanck, Olga B.F., Schuurmans, Frank M.
Published in Solar energy materials and solar cells (01.10.2004)
Published in Solar energy materials and solar cells (01.10.2004)
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Journal Article
Conference Proceeding
Lowering Friction in Timing Chain Drive Systems by Tuning Tensioner Materials
Meuwissen, Marcel, Van Ruiten, Jippe, Besseling, Thijs, van Sluijs, Robbert, Broda, Maik, Pearce, Brian, O’Shea, Fenton I.
Published in SAE International journal of fuels and lubricants (01.04.2017)
Published in SAE International journal of fuels and lubricants (01.04.2017)
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Journal Article
On the origin of lifetime extension for HMPE ropes in bending operations
Meuwissen, Marcel, Glasbergen, Danielle, Kosters, Michel, Bosman, Rigo, Smeets, Paul, Schneiders, Hans
Published in 2013 OCEANS - San Diego (01.09.2013)
Published in 2013 OCEANS - San Diego (01.09.2013)
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Conference Proceeding
Validation of constitutive models for electrically conductive adhesives
Meuwissen, M., van den Nieuwenhof, M., Steijvers, H., van der Waal, A., Bots, T.
Published in 2007 International Conference on Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Systems. EuroSime 2007 (01.04.2007)
Published in 2007 International Conference on Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Systems. EuroSime 2007 (01.04.2007)
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Conference Proceeding
Thermo-mechanical characterisation of a nanosized particle filled underfill
Meuwissen, M., van der Waal, A., Hovens, I., Rentrop, C.
Published in EuroSime 2006 - 7th International Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems (2006)
Published in EuroSime 2006 - 7th International Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems (2006)
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Conference Proceeding
Simulation assisted investigation and improvement of the performance of an electronics assembly subjected to temperature cycling
Lindgren, M., Meuwissen, M., Leisner, P.
Published in EuroSimE 2005. Proceedings of the 6th International Conference on Thermal, Mechanial and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2005 (2005)
Published in EuroSimE 2005. Proceedings of the 6th International Conference on Thermal, Mechanial and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2005 (2005)
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Conference Proceeding