Ohmic Contacts on p-Type Al-Implanted 4H-SiC Layers after Different Post-Implantation Annealings
Spera, Monia, Greco, Giuseppe, Corso, Domenico, Di Franco, Salvatore, Severino, Andrea, Messina, Angelo Alberto, Giannazzo, Filippo, Roccaforte, Fabrizio
Published in Materials (23.10.2019)
Published in Materials (23.10.2019)
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Journal Article
Assessing the Stress Induced by Novel Packaging in GaN HEMT Devices via Raman Spectroscopy
Dahrouch, Zainab, Malta, Giuliana, d’Ambrosio, Moreno, Messina, Angelo Alberto, Musolino, Mattia, Sitta, Alessandro, Calabretta, Michele, Patanè, Salvatore
Published in Applied sciences (01.05.2024)
Published in Applied sciences (01.05.2024)
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Journal Article
Characterization and evaluation of current transport properties of power SiC Schottky diode
Chvála, Aleš, Marek, Juraj, Drobný, Jakub, Stuchlíková, Ľubica, Alberto Messina, Angelo, Vinciguerra, Vincenzo, Donoval, Daniel
Published in Materials today : proceedings (01.01.2022)
Published in Materials today : proceedings (01.01.2022)
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Journal Article
Fabrication of Co–Sb Junction Nanowires by Galvanostatic Electrodeposition
Enache, Laura-Bianca, State, Sabrina, Mihai, Geanina, Prodana, Mariana, Messina, Angelo Alberto, Enachescu, Marius
Published in Langmuir (16.04.2024)
Published in Langmuir (16.04.2024)
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Journal Article
Experimental-numerical characterization of maximum current capability in Si-based surface mounted power devices
Sitta, Alessandro, Mauromicale, Giuseppe, Corrente, Giovanni, Messina, Angelo Alberto, Rundo, Francesco, Calabretta, Michele, Sequenzia, Gaetano
Published in Microelectronics and reliability (01.11.2022)
Published in Microelectronics and reliability (01.11.2022)
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Journal Article
Study of the Thermomechanical Strain Induced by Current Pulses in SiC-Based Power MOSFET
Anoldo, Laura, Triolo, Claudia, Panarello, Saverio, Garesci, Francesca, Russo, Sebastiano, Messina, Angelo Alberto, Calabretta, Michele, Patane, Salvatore
Published in IEEE electron device letters (01.07.2021)
Published in IEEE electron device letters (01.07.2021)
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Journal Article
Nonlinear Robust Control of a Quadratic Boost Converter in a Wide Operation Range, Based on Extended Linearization Method
Alonge, Francesco, Busacca, Alessandro, Calabretta, Michele, D’Ippolito, Filippo, Fagiolini, Adriano, Garraffa, Giovanni, Messina, Angelo Alberto, Sferlazza, Antonino, Stivala, Salvatore
Published in Electronics (Basel) (01.08.2022)
Published in Electronics (Basel) (01.08.2022)
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Journal Article
Surface Topography of Si/TiO2 Stacked Layers on Silicon Substrate Deposited by KrF Excimer Laser Ablation
Moise, Călin Constantin, Pantazi, Aida, Mihai, Geanina Valentina, Jderu, Alin, Bercu, Mircea, Messina, Angelo Alberto, Enăchescu, Marius
Published in Coatings (Basel) (01.11.2021)
Published in Coatings (Basel) (01.11.2021)
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Journal Article
Intelligent Deep Motion Magnification Analysis in Advanced Driving Assistance Systems
Rundo, Francesco, Pino, Carmelo, Castagnolo, Giulia, Messina, Angelo Alberto, Spampinato, Concetto, Calabretta, Michele
Published in 2023 AEIT International Conference on Electrical and Electronic Technologies for Automotive (AEIT AUTOMOTIVE) (17.07.2023)
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Published in 2023 AEIT International Conference on Electrical and Electronic Technologies for Automotive (AEIT AUTOMOTIVE) (17.07.2023)
Conference Proceeding
Intelligent Optical Microscopy Defects Assessment of Silicon-Carbide Power Modules embedded in Next Generation Electric Cars
Rundo, Francesco, Pino, Carmelo, Castagnolo, Giulia, Messina, Angelo Alberto, Spampinato, Concetto, Torrisi, Marco, Calabretta, Michele
Published in 2023 AEIT International Conference on Electrical and Electronic Technologies for Automotive (AEIT AUTOMOTIVE) (17.07.2023)
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Published in 2023 AEIT International Conference on Electrical and Electronic Technologies for Automotive (AEIT AUTOMOTIVE) (17.07.2023)
Conference Proceeding
Thermal Impedance Computation of a SiC Power Module for Traction Inverter in Electric Vehicle Applications
Mauromicale, Giuseppe, Sitta, Alessandro, Rundo, Francesco, Messina, Angelo Alberto, Calabretta, Michele
Published in 2023 AEIT International Conference on Electrical and Electronic Technologies for Automotive (AEIT AUTOMOTIVE) (17.07.2023)
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Published in 2023 AEIT International Conference on Electrical and Electronic Technologies for Automotive (AEIT AUTOMOTIVE) (17.07.2023)
Conference Proceeding
Fast Liquid-to-Liquid Thermal Shock: Experimental Assessment and Mechanical Model for Plastic Package
Amoroso, Davide Maria, Donetti, Luca, Schifano, Biagio, Sitta, Alessandro, Mauromicale, Giuseppe, Sequenzia, Gaetano, Messina, Angelo Alberto, Rundo, Francesco, Calabretta, Michele
Published in 2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) (07.04.2024)
Published in 2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) (07.04.2024)
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Conference Proceeding
Thermography Analysis of Automotive SiC Power Modules for Reliability Assessment
Musolino, Mattia, Mauromicale, Giuseppe, Amoroso, Davide Maria, Donetti, Luca, Sequenzia, Gaetano, Sitta, Alessandro, Messina, Angelo Alberto, Calabretta, Michele
Published in 2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) (07.04.2024)
Published in 2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) (07.04.2024)
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Conference Proceeding
The reliability challenge of SiC Power Modules in Automotive Applications
Calabretta, Michele, Sitta, Alessandro, Mauromicale, Giuseppe, Rundo, Francesco, Sequenzia, Gaetano, Messina, Angelo Alberto
Published in 2022 14th International Conference on Advanced Semiconductor Devices and Microsystems (ASDAM) (23.10.2022)
Published in 2022 14th International Conference on Advanced Semiconductor Devices and Microsystems (ASDAM) (23.10.2022)
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Conference Proceeding
Thermal measurement and numerical analysis for automotive power modules
Sitta, Alessandro, Renna, Marco, Messina, Angelo Alberto, Sequenzia, Gaetano, D'Arrigo, Giuseppe, Calabretta, Michele
Published in 2020 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) (01.07.2020)
Published in 2020 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) (01.07.2020)
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Conference Proceeding
Power losses comparison between Silicon Carbide and Silicon devices for an isolated DC-DC converter
Pellitteri, Filippo, Busacca, Alessandro, Martorana, Carmelo, Miceli, Rosario, Stivala, Salvatore, Messina, Angelo Alberto, Calabretta, Michele, Vinciguerra, Vincenzo
Published in 2021 IEEE 15th International Conference on Compatibility, Power Electronics and Power Engineering (CPE-POWERENG) (14.07.2021)
Published in 2021 IEEE 15th International Conference on Compatibility, Power Electronics and Power Engineering (CPE-POWERENG) (14.07.2021)
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Conference Proceeding
The "first and euRopEAn siC eighT Inches pilOt liNe": a project, called REACTION, that will boost key SiC Technologies upgrading (developments) in Europe, unleashing Applications in the Automotive Power Electronics Sector
Messina, Angelo Alberto, Imbruglia, Antonio, Calabretta, Michele, Vinciguerra, Vincenzo, Moise, Calin Constantin, Sitta, Alessandro, Enachescu, Marius, Roccaforte, Fabrizio
Published in 2020 AEIT International Conference of Electrical and Electronic Technologies for Automotive (AEIT AUTOMOTIVE) (18.11.2020)
Published in 2020 AEIT International Conference of Electrical and Electronic Technologies for Automotive (AEIT AUTOMOTIVE) (18.11.2020)
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Conference Proceeding
Thermo-mechanical finite element simulation and visco-plastic solder fatigue for low voltage discrete package
Sitta, Alessandro, Mauromicale, Giuseppe, Sequenzia, Gaetano, Messina, Angelo Alberto, Renna, Marco, Calabretta, Michele
Published in 2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) (19.04.2021)
Published in 2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) (19.04.2021)
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Conference Proceeding