Board Level Reliability Study of Next Generation Large Die Wafer Level Chip Scale Package Structures
Henttonen, Timo, Mescher, Paul, Scott, Doug, Park, Han, Ko, YongJae, Engel, Kevin
Published in 2018 International Wafer Level Packaging Conference (IWLPC) (01.10.2018)
Published in 2018 International Wafer Level Packaging Conference (IWLPC) (01.10.2018)
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Conference Proceeding
Semiconductor chip package
MESCHER PAUL ALLEN, LAFONTAINE, JR. WILLIAM RENA, WOYCHIK CHARLES GERARD
Year of Publication 25.09.2001
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Year of Publication 25.09.2001
Patent