LAOS: The strain softening/strain hardening paradox
Mermet-Guyennet, M. R. B., Gianfelice de Castro, J., Habibi, M., Martzel, N., Denn, M. M., Bonn, D.
Published in Journal of rheology (New York : 1978) (01.01.2015)
Published in Journal of rheology (New York : 1978) (01.01.2015)
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Journal Article
Size-dependent reinforcement of composite rubbers
Mermet-Guyennet, M.R.B., Gianfelice de Castro, J., Varol, H.S., Habibi, M., Hosseinkhani, B., Martzel, N., Sprik, R., Denn, M.M., Zaccone, A., Parekh, S.H., Bonn, D.
Published in Polymer (Guilford) (01.09.2015)
Published in Polymer (Guilford) (01.09.2015)
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Journal Article
Temperature measurement on series resistance and devices in power packs based on on-state voltage drop monitoring at high current
Perpiñà, X., Serviere, J.F., Saiz, J., Barlini, D., Mermet-Guyennet, M., Millán, J.
Published in Microelectronics and reliability (01.09.2006)
Published in Microelectronics and reliability (01.09.2006)
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Journal Article
Conference Proceeding
Measurement of the transient junction temperature in MOSFET devices under operating conditions
Barlini, D., Ciappa, M., Mermet-Guyennet, M., Fichtner, W.
Published in Microelectronics and reliability (01.09.2007)
Published in Microelectronics and reliability (01.09.2007)
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Journal Article
Conference Proceeding
Invagination process induced by 2D desiccation of colloidal solutions
Pauchard, L., Mermet-Guyennet, M., Giorgiutti-Dauphiné, F.
Published in Chemical engineering and processing (01.05.2011)
Published in Chemical engineering and processing (01.05.2011)
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Journal Article
Conference Proceeding
Reliability of lead-free solder in power module with stochastic uncertainty
Micol, A., Martin, C., Dalverny, O., Mermet-Guyennet, M., Karama, M.
Published in Microelectronics and reliability (01.06.2009)
Published in Microelectronics and reliability (01.06.2009)
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Journal Article
Revisiting power cycling test for better life-time prediction in traction
Mermet-Guyennet, M., Perpiñá, X., Piton, M.
Published in Microelectronics and reliability (01.09.2007)
Published in Microelectronics and reliability (01.09.2007)
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Journal Article
Conference Proceeding
Failure-relevant abnormal events in power inverters considering measured IGBT module temperature inhomogeneities
Perpiñà, X., Castellazzi, A., Piton, M., Mermet-Guyennet, M., Millán, J.
Published in Microelectronics and reliability (01.09.2007)
Published in Microelectronics and reliability (01.09.2007)
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Journal Article
Conference Proceeding
IGBT module failure analysis in railway applications
Perpiñà, X., Serviere, J.F., Jordà, X., Fauquet, A., Hidalgo, S., Urresti-Ibañez, J., Rebollo, J., Mermet-Guyennet, M.
Published in Microelectronics and reliability (01.08.2008)
Published in Microelectronics and reliability (01.08.2008)
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Journal Article
Conference Proceeding
A study of the threshold-voltage suitability as an application-related reliability indicator for planar-gate non-punch-through IGBTs
Castellazzi, A., Ciappa, M., Fichtner, W., Piton, M., Mermet-Guyennet, M.
Published in Microelectronics and reliability (01.09.2007)
Published in Microelectronics and reliability (01.09.2007)
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Journal Article
Conference Proceeding
Thermal fatigue effects on the temperature distribution inside IGBT modules for zone engine aeronautical applications
Lhommeau, T., Perpiñà, X., Martin, C., Meuret, R., Mermet-Guyennet, M., Karama, M.
Published in Microelectronics and reliability (01.09.2007)
Published in Microelectronics and reliability (01.09.2007)
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Journal Article
Conference Proceeding
Local thermal cycles determination in thermosyphon-cooled traction IGBT modules reproducing mission profiles
Perpiñà, X., Piton, M., Mermet-Guyennet, M., Jordà, X., Millán, J.
Published in Microelectronics and reliability (01.09.2007)
Published in Microelectronics and reliability (01.09.2007)
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Journal Article
Conference Proceeding
Performance and reliability testing of modern IGBT devices under typical operating conditions of aeronautic applications
Fock-Sui-Too, J.L., Chauchat, B., Austin, P., Tounsi, P., Mermet-Guyennet, M., Meuret, R.
Published in Microelectronics and reliability (01.08.2008)
Published in Microelectronics and reliability (01.08.2008)
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Journal Article
Conference Proceeding
Robustness test and failure analysis of IGBT modules during turn-off
Urresti-Ibañez, J., Castellazzi, A., Piton, M., Rebollo, J., Mermet-Guyennet, M., Ciappa, M.
Published in Microelectronics and reliability (01.09.2007)
Published in Microelectronics and reliability (01.09.2007)
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Journal Article
Conference Proceeding
Virtual reliability assessment of integrated power switches based on multi-domain simulation approach
Solomalala, P., Saiz, J., Mermet-Guyennet, M., Castellazzi, A., Ciappa, M., Chauffleur, X., Fradin, J.P.
Published in Microelectronics and reliability (01.09.2007)
Published in Microelectronics and reliability (01.09.2007)
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Journal Article
Conference Proceeding
Reliability of the connections used in IGBT modules, in aeronautical environment
Zéanh, A., Dalverny, O., Karama, M., Woirgard, E., Azzopardi, S., Bouzourene, A., Casutt, J., Mermet-Guyennet, M.
Published in International journal for simulation and multidisciplinary design optimization (01.04.2008)
Published in International journal for simulation and multidisciplinary design optimization (01.04.2008)
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Journal Article
New technique for the measurement of the static and of the transient junction temperature in IGBT devices under operating conditions
Barlini, D., Ciappa, M., Castellazzi, A., Mermet-Guyennet, M., Fichtner, W.
Published in Microelectronics and reliability (01.09.2006)
Published in Microelectronics and reliability (01.09.2006)
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Journal Article
Conference Proceeding
Power device stacking using surface bump connections
Castellazzi, A., Mermet-Guyennet, M.
Published in 2009 21st International Symposium on Power Semiconductor Devices & IC's (01.06.2009)
Published in 2009 21st International Symposium on Power Semiconductor Devices & IC's (01.06.2009)
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Conference Proceeding
Compact modelling and analysis of power-sharing unbalances in IGBT-modules used in traction applications
Castellazzi, A., Ciappa, M., Fichtner, W., Lourdel, G., Mermet-Guyennet, M.
Published in Microelectronics and reliability (01.09.2006)
Published in Microelectronics and reliability (01.09.2006)
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Journal Article
Conference Proceeding