FIB tilting method for thin TEM lamella preparation
Liew Kaeng Nan, Lee Meng Lung, Chen Tung Hung
Published in 2015 IEEE 22nd International Symposium on the Physical and Failure Analysis of Integrated Circuits (01.06.2015)
Published in 2015 IEEE 22nd International Symposium on the Physical and Failure Analysis of Integrated Circuits (01.06.2015)
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Conference Proceeding
Study of FIB milling induced damage and contamination on ex-situ lift-out TEM specimen and methodology to reduce the artifacts
Liew Kaeng Nan, Lee Meng Lung
Published in Proceedings of the 20th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) (01.07.2013)
Published in Proceedings of the 20th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) (01.07.2013)
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Conference Proceeding
TEM sample preparation by single-sided low-energy ion beam etching
Liew Kaeng Nan, Lee Meng Lung
Published in 2012 19th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (01.07.2012)
Published in 2012 19th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (01.07.2012)
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Conference Proceeding
A simple method for TEM sample preparation without carbon film background
Meng-Lung Lee, Ren-De Lin
Published in 2008 15th International Symposium on the Physical and Failure Analysis of Integrated Circuits (01.07.2008)
Published in 2008 15th International Symposium on the Physical and Failure Analysis of Integrated Circuits (01.07.2008)
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Conference Proceeding
TEM Sample Preparation by Single-sided Low-energy Ion Beam Etching
Nan, Liew Kaeng, Lung, Lee Meng
Published in Illumina Technology Records - unstructured (01.01.2011)
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Published in Illumina Technology Records - unstructured (01.01.2011)
Journal Article