Void dynamics in copper-based interconnects
Choi, Zung-Sun, Lee, Junghoon, Lim, Meng Keong, Gan, Chee Lip, Thompson, Carl V.
Published in Journal of applied physics (01.08.2011)
Published in Journal of applied physics (01.08.2011)
Get full text
Journal Article
Experimental characterization and modelling of electromigration lifetime under unipolar pulsed current stress
Lim, Meng Keong, Lin, Jingyuan, Ee, Yong Chiang, Ng, Chee Mang, Wei, Jun, Gan, Chee Lip
Published in Microelectronics and reliability (01.08.2012)
Published in Microelectronics and reliability (01.08.2012)
Get full text
Journal Article
Conference Proceeding
Low Thermal Budget Fine-pitch Cu/Dielectric Hybrid Bonding with Cu Microstructure Modifications
Cheemalamarri, Hemanth Kumar, Van Nhat Anh, Tran, Guan, Chen Gim, Lim, Meng Keong, Vempati, Srinivasa Rao, Singh, Navab
Published in 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) (28.05.2024)
Published in 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) (28.05.2024)
Get full text
Conference Proceeding
Non-Destructive High-Resolution Tomographic Cross-Sectional Imaging on Suspended Structures Inside a Mems Package
Haiwen, Dai, Ping, Zhao Si, Keong, Lim Meng, Saraswatula, Jagdish, Rauscher, Michael
Published in 2021 China Semiconductor Technology International Conference (CSTIC) (14.03.2021)
Published in 2021 China Semiconductor Technology International Conference (CSTIC) (14.03.2021)
Get full text
Conference Proceeding