Search Results - "Mei, Yun-Hui" :: K.UTB vyhledávací portál

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A Double-Sided Bidirectional Power Module With Low Heat Concentration and Low Thermomechanical Stress

by Cao, Junlin, Li, Jing, Mei, Yun-Hui
Published in IEEE transactions on power electronics (01.09.2021)

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Pressureless Sintered-Silver Die-Attach at 180 °C for Power Electronics Packaging

by Wang, Meiyu, Mei, Yun-Hui, Jin, Jingyou, Chen, Shi, Li, Xin, Lu, Guo-Quan
Published in IEEE transactions on power electronics (01.11.2021)

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Copper-Wire Stress Buffers for Extending Lifetime of Double-Sided Bidirectional SiC Modules

by Liu, Siqi, Mei, Yun-Hui, Li, Jing, Li, Xin, Lu, Guo-Quan
Published in IEEE transactions on power electronics (01.06.2023)

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Reliable Aluminum Wire-Bonded SiC/Si Diodes With Laminated Al/Cu Stress Buffers

by Li, Xiao-Di, Lu, Guo-Quan, Mei, Yun-Hui
Published in IEEE transactions on power electronics (01.09.2022)

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Reliability Improvement of Low-temperature Sintered Nano-silver as Die Attachment by Porosity Optimization

by Zhang, Bowen, Zhang, Shaoqiong, Lu, Xinyan, Han, Lili, Mei, Yun-Hui
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.08.2023)

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Development of Silver Paste With High Sintering Driving Force for Reliable Packaging of Power Electronics

by Zhang, Bowen, Lu, Xinyan, Ma, Haoxiang, Wang, Di, Mei, Yun-Hui
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.01.2024)

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A Multichip Phase-Leg IGBT Module Using Nanosilver Paste by Pressureless Sintering in Formic Acid Atmosphere

by Yan, Haidong, Mei, Yun-Hui, Li, Xin, Ma, Changsheng, Lu, Guo-Quan
Published in IEEE transactions on electron devices (01.10.2018)

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Insulation and Reliability Enhancement by a Nonlinear Conductive Polymer-Nanoparticle Coating for Packaging of High-Voltage Power Devices

by Sun, Kai-Bing, Mei, Yun-Hui, Shuai, Zhi-Bin, Li, Longnv
Published in IEEE transactions on dielectrics and electrical insulation (01.12.2023)

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Creep properties of low-temperature sintered nano-silver lap shear joints

by XIN LI, GANG CHEN, LEI WANG, MEI, Yun-Hui, XU CHEN, LU, Guo-Quan
Published in Materials science & engineering. A, Structural materials : properties, microstructure and processing (01.09.2013)

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Local Interconnection Degradation of a Double-Sided Cooling SiC MOSFET Module Under Power Cycling

by Chen, Yue, Mei, Yun-Hui, Ning, Puqi, Lu, Guo-Quan
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.05.2024)

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Study on high temperature bonding reliability of sintered nano-silver joint on bare copper plate

by Zhao, Su-Yan, Li, Xin, Mei, Yun-Hui, Lu, Guo-Quan
Published in Microelectronics and reliability (01.12.2015)

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Large-Area Bonding by Sintering of a Resin-Free Nanosilver Paste at Ultralow Temperature of 180 °C

by Chen, Shi, Mei, Yun-Hui, Wang, Meiyu, Li, Xin, Lu, Guo-Quan
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.04.2022)

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On-Site Estimation of Thermal Resistance Degradation of Double-Sided Cooling (DSC) Power Modules under Power Cycling Conditions

by Chen, Yue, Mei, Yun-Hui, Ning, Puqi, Lu, Guo-Quan
Published in IEEE journal of emerging and selected topics in power electronics (01.08.2023)

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Pressureless sintering multi-scale Ag paste by a commercial vacuum reflowing furnace for massive production of power modules

by Yan, Haidong, Mei, Yun-Hui, Wang, Meiyu, Li, Xin, Lu, Guo-Quan
Published in Journal of materials science. Materials in electronics (01.05.2019)

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Enhanced pressureless bonding by Tin Doped Silver Paste at low sintering temperature

by Yang, Cheng-Xiang, Li, Xin, Lu, Guo-Quan, Mei, Yun-Hui
Published in Materials science & engineering. A, Structural materials : properties, microstructure and processing (13.04.2016)

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High-Temperature Characterizations of a Half-Bridge Wire-Bondless SiC MOSFET Module

by Chen, Yue, Lei, Guangyin, Lu, Guo-Quan, Mei, Yun-Hui
Published in IEEE journal of the Electron Devices Society (2021)

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A Reliable Way to Improve Electrochemical Migration (ECM) Resistance of Nanosilver Paste as a Bonding Material

by Ding, Zikun, Wang, Zhichao, Zhang, Bowen, Lu, Guo-Quan, Mei, Yun-Hui
Published in Applied sciences (01.05.2022)

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Novel interface material used in high power electronic die-attaching on bare Cu substrates

by Zhao, Su-Yan, Li, Xin, Mei, Yun-Hui, Lu, Guo-Quan
Published in Journal of materials science. Materials in electronics (01.10.2016)

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Large-Area Substrate Bonding With Single-Printing Silver Paste Sintering for Power Modules

by Zhang, Hong-Yu, Li, Xin, Jiang, Han-Ning, Mei, Yun-Hui, Lu, Guo-Quan
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.01.2021)

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Effects of Die-Attach Material and Ambient Temperature on Properties of High-Power COB Blue LED Module

by Ya-Fei Kong, Xin Li, Yun-Hui Mei, Guo-Quan Lu
Published in IEEE transactions on electron devices (01.07.2015)

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