Electrochemical migration study of fine pitch lead free micro bump interconnect
Yu, Da-Quan, Chai, Tai Chong, Thew, Meei Ling, Ong, Yue Ying
Published in 2009 11th Electronics Packaging Technology Conference (01.12.2009)
Published in 2009 11th Electronics Packaging Technology Conference (01.12.2009)
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Conference Proceeding
Wafer Level Hermetic Bonding Using Sn/In and Cu/Ti/Au Metallization
Daquan Yu, Liling Yan, Chengkuo Lee, Won Kyoung Choi, Meei Ling Thew, Chin Keng Fool, Lau, J.H.
Published in 2008 10th Electronics Packaging Technology Conference (01.12.2008)
Published in 2008 10th Electronics Packaging Technology Conference (01.12.2008)
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Conference Proceeding
Evaluation of support wafer system for thin wafer handling
Justin, W H S T, Tai Chong Chai, Rao, V S, David, S W H, Fernandez, D M, Li Yan Siow, Wen Sheng Lee, Serene, M L T, Lee, J
Published in 2010 12th Electronics Packaging Technology Conference (01.12.2010)
Published in 2010 12th Electronics Packaging Technology Conference (01.12.2010)
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Conference Proceeding
Electromigration study of 50 µm pitch micro solder bumps using four-point Kelvin structure
Da-Quan Yu, Tai Chong Chai, Meei Ling Thew, Yue Ying Ong, Rao, V.S., Leong Ching Wai, Lau, J.H.
Published in 2009 59th Electronic Components and Technology Conference (01.05.2009)
Published in 2009 59th Electronic Components and Technology Conference (01.05.2009)
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Conference Proceeding
150-μm Pitch Cu/Low-k Flip Chip Packaging With Polymer Encapsulated Dicing Line (PEDL) and Cu Column Interconnects
SEUNG WOOK YOON, THEW, Serene Meei Ling, LIM, Samuel Yak Long, WAI YIN HNIN, TAI CHONG CHAI, VISWANATH, Akella G. K, KRIPESH, Vaidyanathan
Published in IEEE transactions on advanced packaging (01.02.2008)
Published in IEEE transactions on advanced packaging (01.02.2008)
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Journal Article