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Year of Publication 17.12.2019
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MULTILAYER CERAMIC CAPACITOR WITH LOW ACOUSTIC NOISE
Tsai, Ming Y, Bushnell, Tyler S, Wang, Albert, Mead, Curtis C, Martinez, Paul A
Year of Publication 22.11.2018
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Year of Publication 22.11.2018
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RELIABLE CAPACITOR STRUCTURES
Ning, Gang, Schauer, Martin, Tsai, Ming Yuan, Choi, Won Seop, Wang, Albert, Shah, Chirag V, Mead, Curtis C, Martinez, Paul A
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Year of Publication 02.04.2020
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Printed circuit board assembly having a damping layer
Li, Gemin, Yoo, Sung Woo, Duke, Connor R, Gong, Zhong-Qing, Richardson, Kevin R, Bard, Benjamin A, Martinez, Paul, Kottke, Nelson J, Mead, Curtis C, Poulain, Kieran
Year of Publication 01.10.2019
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Year of Publication 01.10.2019
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Reduced electrical terminations in surface-mount technology components
De La Cruz, Giancarlo F, Wang, Albert, Vo, Vu, Mead, Curtis C, Morrison, Scott D, Chen, Lin, Chen, Wyeman, Simeral, Brad W, Martinez, Paul A
Year of Publication 24.09.2019
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Year of Publication 24.09.2019
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STACKABLE PASSIVE COMPONENT
De La Cruz Giancarlo F, Morrison Scott D, Chen Lin, Mead Curtis C, Wang Albert, Simeral Brad W, Martinez Paul A
Year of Publication 29.03.2018
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Year of Publication 29.03.2018
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REDUCED ELECTRICAL TERMINATIONS IN SURFACE-MOUNT TECHNOLOGY COMPONENTS
De La Cruz Giancarlo F, Chen Wyeman, Morrison Scott D, Chen Lin, Mead Curtis C, Wang Albert, Vo Vu, Simeral Brad W, Martinez Paul A
Year of Publication 20.07.2017
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Year of Publication 20.07.2017
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PRINTED CIRCUIT BOARD ASSEMBLY HAVING A DAMPING LAYER
Li Gemin, Bard Benjamin A, Mead Curtis C, Poulain Kieran, Gong Zhong-Qing, Richardson Kevin R, Martinez Paul, Duke Connor R, Kottke Nelson J, Yoo Sung Woo
Year of Publication 02.03.2017
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Year of Publication 02.03.2017
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Printed Circuit Board Assembly Having A Damping Layer
CURTIS C. MEAD, ZHONG-QING GONG, BENJAMIN A. BARD, SUNG WOO YOO, KEVI R. RICHARDSON, GEMIN LI, NELSON J. KOTTKE, PAUL MARTINEZ, CONNOR R. DUKE, KIERAN POULAIN
Year of Publication 08.03.2017
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Year of Publication 08.03.2017
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