Search Results - "McLellan Neil" :: K.UTB vyhledávací portál | TBU Library Retrieval Portal

Conductor Bump Method and Apparatus

Conductor Bump Method and Apparatus

by TOPACIO RODEN R, LEUNG ANDREW KW, MCLELLAN NEIL, LOW YIP SENG
Year of Publication 05.02.2009

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Patent

SEMICONDUCTOR DEVICE HAVING A BUMP ELECTRODE AND METHOD FOR ITS MANUFACTURE

SEMICONDUCTOR DEVICE HAVING A BUMP ELECTRODE AND METHOD FOR ITS MANUFACTURE

by MCLELLAN, NEIL, LEUNG, ANDREW KW, TOPACIO, RODEN, LOW, YIP, SENG
Year of Publication 05.02.2009

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Patent

Delayed reflow alloy mix solder paste

Delayed reflow alloy mix solder paste

by MCLELLAN; NEIL R
Year of Publication 30.08.1988

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Patent

Saw-singulated leadless plastic chip carrier

Saw-singulated leadless plastic chip carrier

by Fan, Nelson, Mclellan, Neil, Sheppard, Robert
Year of Publication 18.10.2001

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Patent

Saw-singulated leadless plastic chip carrier

Saw-singulated leadless plastic chip carrier

by FAN NELSON, MCLELLAN NEIL, SHEPPARD ROBERT P
Year of Publication 18.10.2001

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Patent

Integrated circuit package and method of manufacturing the integrated circuit package

Integrated circuit package and method of manufacturing the integrated circuit package

by Pedron, Serafin, McLellan, Neil Robert, Yee, Lin Tsui
Year of Publication 06.09.2005

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Patent

Integrated circuit package and method of manufacturing the integrated circuit package

Integrated circuit package and method of manufacturing the integrated circuit package

by MCLELLAN NEIL ROBERT, PEDRON SERAFIN, YEE LIN TSUI
Year of Publication 06.09.2005

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Patent

Ball grid array package and process for manufacturing same

Ball grid array package and process for manufacturing same

by KIRLOSKAR MOHAN, FAN CHUN HO, MCLELLAN NEIL
Year of Publication 23.08.2005

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Patent

Integrated circuit package with partially exposed contact pads and process for fabricating the same

Integrated circuit package with partially exposed contact pads and process for fabricating the same

by McLellan, Neil, Lin, Geraldine Tsui Yee, Fan, Chun Ho, Kirloskar, Mohan, Varga, Ed A
Year of Publication 12.08.2008

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Patent

Thin array plastic package without die attach pad and process for fabricating the same

Thin array plastic package without die attach pad and process for fabricating the same

by HIGGINS, III LEO M, TSANG KWOK CHEUNG, KWAN KIN PUI, PEDRON SERAFIN, MCLELLAN NEIL
Year of Publication 15.04.2008

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Patent

Thin array plastic package without die attach pad and process for fabricating the same

Thin array plastic package without die attach pad and process for fabricating the same

by McLellan, Neil, Pedron, Serafin, Higgins, III, Leo M, Tsang, Kwok Cheung, Kwan, Kin Pui
Year of Publication 15.04.2008

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Patent

Semiconductor chip with supportive terminal pad

Semiconductor chip with supportive terminal pad

by MCLELLAN, NEIL, TOPACIO, RODEN R, SU, MICHAEL Z
Year of Publication 01.11.2012

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Patent

Circuit board with via trace connection and method of making the same

Circuit board with via trace connection and method of making the same

by LEUNG ANDREW KW, MCLELLAN NEIL, LOW YIP SENG
Year of Publication 24.10.2012

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Patent

Effects of Microstructure on Thermal and Mechanical Properties of PBGA Substrates

Effects of Microstructure on Thermal and Mechanical Properties of PBGA Substrates

by Tang, G.C., Shing, J.W.K., Haibin Chen, Lee, R., Jingshen Wu
Published in 2006 International Conference on Electronic Materials and Packaging (01.12.2006)

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Conference Proceeding

Ball grid array package that includes a collapsible spacer for separating die adapter from a heat spreader

Ball grid array package that includes a collapsible spacer for separating die adapter from a heat spreader

by Fan, Chun Ho, Lam, Wing Keung, Sze, Ming Wang, Labeeb, Sadak Thamby, McLellan, Neil, Kirloskar, Mohan
Year of Publication 01.01.2008

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Patent

Leadless plastic chip carrier

Leadless plastic chip carrier

by LAU WING HIM, TSANG KWOK CHEUNG, FAN CHUN HO, KWAN KIN PUI, MCLELLAN NEIL
Year of Publication 18.09.2007

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Patent

Leadless plastic chip carrier with etch back pad singulation

Leadless plastic chip carrier with etch back pad singulation

by LAU WING HIM, TSANG KWOK CHEUNG, FAN CHUN HO, KWAN KIN PUI, MCLELLAN NEIL
Year of Publication 18.09.2007

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Patent

Leadless plastic chip carrier

Leadless plastic chip carrier

by Kwan, Kin Pui, Lau, Wing Him, Tsang, Kwok Cheung, Fan, Chun Ho, McLellan, Neil
Year of Publication 18.09.2007

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Patent

Leadless plastic chip carrier with etch back pad singulation

Leadless plastic chip carrier with etch back pad singulation

by McLellan, Neil, Fan, Chun Ho, Tsang, Kwok Cheung, Kwan, Kin Pui, Lau, Wing Him
Year of Publication 18.09.2007

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Patent

Method of manufacturing enhanced thermal dissipation integrated circuit package

Method of manufacturing enhanced thermal dissipation integrated circuit package

by MCLELLAN NEIL ROBERT, FAN CHUN H, COMBS EDWARD G
Year of Publication 11.03.2004

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Patent

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