Effect of TSV density on local stress concentration: Micro-Raman spectroscopy measurement and Finite Element Analysis
Le Texier, F., Mazuir, J., Su, M., Castagné, L., Souriau, J.-C., Liotard, J.-L., Saadaoui, M., Inal, K.
Published in Microelectronic engineering (01.06.2013)
Published in Microelectronic engineering (01.06.2013)
Get full text
Journal Article
Conference Proceeding
Assessment and Characterization of Stress Induced by Via-First TSV Technology
PARES, G, DE CRECY, F, MOREAU, S, MAURICE, C, BORBELY, A, MAZUIR, J, CHAPELON, L. L, SILLON, N
Published in Journal of microelectronics and electronic packaging (01.10.2011)
Published in Journal of microelectronics and electronic packaging (01.10.2011)
Get full text
Journal Article
Evaluation and optimization of die-shift in Embedded Wafer-Level Packaging by enhancing the adhesion strength of silicon chips to carrier wafer
Mazuir, J., Olmeta, V., Yin, M., Pares, G., Planchais, A., Inal, K., Saadaoui, M.
Published in 2011 IEEE 13th Electronics Packaging Technology Conference (01.12.2011)
Published in 2011 IEEE 13th Electronics Packaging Technology Conference (01.12.2011)
Get full text
Conference Proceeding
3D embedded wafer-level packaging technology development for smart card SIP application
Pares, G., Bouvier, C., Saadaoui, M., Mazuir, J., Noiray, J., Martinschitz, K., Planchais, A., Simon, G.
Published in 2012 IEEE 14th Electronics Packaging Technology Conference (EPTC) (01.12.2012)
Published in 2012 IEEE 14th Electronics Packaging Technology Conference (EPTC) (01.12.2012)
Get full text
Conference Proceeding
Demonstration of a 3D embedded wafer-level SIP for smartcard application
Pares, G., Bouvier, C., Castagne, L., Saadaoui, M., Mazuir, J., Noiray, J., Martinschitz, K., Mercier, L., Planchais, A., Simon, G.
Published in 2013 Eurpoean Microelectronics Packaging Conference (EMPC) (01.09.2013)
Get full text
Published in 2013 Eurpoean Microelectronics Packaging Conference (EMPC) (01.09.2013)
Conference Proceeding
Investigation of local stress around TSVs by micro-Raman spectroscopy and finite element simulation
Le Texier, F., Mazuir, J., Su-Yin, M., Saadaoui, M., Liotard, J., Inal, K.
Published in 2011 IEEE International Interconnect Technology Conference (01.05.2011)
Published in 2011 IEEE International Interconnect Technology Conference (01.05.2011)
Get full text
Conference Proceeding
3D multi-stacking of thin dies based on TSV and micro-inserts interconnections
Souriau, Jean-Charles, Castagne, L., Liotard, J., Inal, K., Mazuir, J., Le Texier, F., Fresquet, G., Varvara, M., Launay, N., Dubois, B., Malia, T.
Published in 2012 IEEE 62nd Electronic Components and Technology Conference (01.05.2012)
Published in 2012 IEEE 62nd Electronic Components and Technology Conference (01.05.2012)
Get full text
Conference Proceeding