Strain dependency in wrinkling performance of butanetetracarboxylic acid and lubricant-treated cotton fabric
Asvadi, Sima, Janner, Anna-Maria, Hultermans, Edo, Mavinkurve, Amar, Ormandy, Kevin, Southey-Davis, Hannah, Jarvis, Paula, Griffith, Llyr
Published in Textile research journal (01.06.2012)
Published in Textile research journal (01.06.2012)
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Journal Article
Copper Pillar Voids in a Flip Chip Package During High Temperature Application
Wang, Miao, Mavinkurve, Amar, Roucou, Romuald, Afripin, Amirul, Uehling, Trent, Foong, Cs, Lakhera, Nishant
Published in 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) (01.05.2023)
Published in 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) (01.05.2023)
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Conference Proceeding
Effect of Material Aging on the Reliability of an Automotive BGA Device Under Temperature Cycling Test Conditions
Fahim, Abdullah, Zhang, Ryan, Mavinkurve, Amar, Shantaram, Sandeep, Adli, Ali Rezaie, Tanwongwan, Wiwat, Hauck, Torsten
Published in 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) (28.05.2024)
Published in 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) (28.05.2024)
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Conference Proceeding
Intermetallic Growth and Void Formation Mechanism in Flip Chip Copper Pillar Interconnects: Role of the Underfill Material
Wang, Miao, Uehling, Trent, Mavinkurve, Amar, Uehling, Paige, Ahmed, Sudan, Foong, Cs
Published in 2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC) (07.12.2021)
Published in 2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC) (07.12.2021)
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Conference Proceeding
A Holistic Approach to Predict Wirebond Corrosion Failure in Extreme Operating Environments
Asaduz Zaman Mamun, M., Mavinkurve, Amar, Rongen, Rene, Van Soestbergen, Michiel, Alam, Muhammad A.
Published in 2023 International Electron Devices Meeting (IEDM) (09.12.2023)
Published in 2023 International Electron Devices Meeting (IEDM) (09.12.2023)
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Conference Proceeding
A Continuously Updated Package-Degradation Model reflecting Thermomechanical Changes at Different Thermo-Oxidative Stages of Moulding Compound
Inamdar, Adwait, Soestbergen, Michiel van, Mavinkurve, Amar, Driel, Willem van, Zhang, GuoQi
Published in 2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) (17.04.2023)
Published in 2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) (17.04.2023)
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Conference Proceeding
Reaction Kinetics and Rheological Model Coefficient Extraction for Epoxy Mold Compounds
Sakib, A R Nazmus, Jha, Vibhash, Mavinkurve, Amar, Chopin, Sheila
Published in 2018 17th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) (01.05.2018)
Published in 2018 17th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) (01.05.2018)
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Conference Proceeding
The How and why of Biased Humidity Tests with Copper Wire
Mavinkurve, A., Rongen, R.T.H., Goumans, L., Farrugia, M-L, van Olst, E., O'Halloran, Orla, van Soestbergen, M.
Published in 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) (01.05.2019)
Published in 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) (01.05.2019)
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Conference Proceeding
Degradation of Cu-Al wire bonded contacts under high current and high temperature conditions using in-situ resistance monitoring
Rongen, Rene, van IJzerloo, Arjan, Mavinkurve, Amar, O'Halloran, G. M.
Published in 2015 IEEE 65th Electronic Components and Technology Conference (ECTC) (01.05.2015)
Published in 2015 IEEE 65th Electronic Components and Technology Conference (ECTC) (01.05.2015)
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Conference Proceeding