by Heyer, R, Schallert, K, Siewert, C, Kohrs, F, Greve, J, Maus, I, Klang, J, Klocke, M, Heiermann, M, Hoffmann, M, Püttker, S, Calusinska, M, Zoun, R, Saake, G, Benndorf, D, Reichl, U
Published in Microbiome (27.04.2019)

by Sadeghinia, M., Jansen, K.M.B., Ernst, L.J., Pape, H., Maus, I., van Driel, W.D., Zhang, G.Q.
Published in International journal of adhesion and adhesives (01.03.2014)

by Maus, I., Niessner, M., Zhang, M., Hartner, W., Seiler, B., Altieri-Weimar, P.
Published in 2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) (07.04.2024)

by Maus, I., Preu, H., Niessner, M., Fink, M., Jansen, K. M. B., Pantou, R., Michel, B., Wunderle, B.
Published in 2014 15th International Conference on Thermal, Mechanical and Mulit-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) (01.04.2014)

by Keller, J, Maus, I, Schlottig, G, Pape, H, Wunderle, B, Michel, B
Published in 3rd Electronics System Integration Technology Conference ESTC (01.09.2010)

by Schlottig, G, Maus, I, Walter, H, Jansen, K, Pape, H, Wunderle, B, Ernst, L J
Published in 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) (01.06.2010)

by Wunderle, B., Schulz, M., Keller, J., Maus, I., Pape, H., Michel, B.
Published in 13th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (01.05.2012)

by Pape, H., Maus, I., Nabi, H. S., Ernst, L. J., Wunderle, B.
Published in 2012 IEEE 62nd Electronic Components and Technology Conference (01.05.2012)

by Maus, I., Liebl, C., Fink, M., Vu, D.-K, Hartung, M., Preu, H., Jansen, K. M. B., Michel, B., Wunderle, B., Weiss, L.
Published in 2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) (01.04.2017)

by Wunderle, B., Schulz, M., Keller, J., May, D., Maus, I., Pape, H., Michel, B.
Published in 2012 13th International Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (01.04.2012)

by Maus, I., Pape, H., Nabi, H. S., Michel, B., Wunderle, B.
Published in 2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) (01.04.2013)

by Wunderle, B., Schulz, M., Keller, J., Schlottig, G., Maus, I., May, D., Holck, O., Pape, H., Michel, B.
Published in 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) (01.05.2011)

by Maus, I., Preu, H., Niessner, M., Nabi, H., Jansen, K. M. B., Pantou, R., Weiss, L., Michel, B., Wunderle, B.
Published in Proceedings of the 5th Electronics System-integration Technology Conference (ESTC) (01.09.2014)

by Pape, H., Maus, I., Paul, I., Ernst, L. J., Wunderle, B.
Published in 2012 13th International Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (01.04.2012)

by Maus, I., Pape, H., Nabi, H. S., Goroll, M., Preu, H., Keller, J., Ernst, L. J., Michel, B., Wunderle, B.
Published in 2012 13th International Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (01.04.2012)

by Vogel, D, Maus, I, Michel, B
Published in 3rd Electronics System Integration Technology Conference ESTC (01.09.2010)

by Maus, Irena, Kim, Yong Sung, Wibberg, Daniel, Stolze, Yvonne, Off, Sandra, Antonczyk, Sebastian, Puhler, Alfred, Scherer, Paul, Schluter, Andreas
Published in Journal of microbiology and biotechnology (28.02.2017)

by MAUS GEOFFREY B, SELVIUS RYAN
Year of Publication 16.12.2022

by GEHRING OTTMAR, BALLARIN CHRISTIAN, MAUS STEFFEN
Year of Publication 28.02.2023

by HOLTRICHTER ROESSMANN THORSTEN, MAUS SILVIA, HOFMANN BIANKA
Year of Publication 07.10.2021