Fracture toughness of intermetallic Cu6Sn5 in lead-free solder microelectronics
Philippi, Bastian, Matoy, Kurt, Zechner, Johannes, Kirchlechner, Christoph, Dehm, Gerhard
Published in Scripta materialia (01.10.2016)
Published in Scripta materialia (01.10.2016)
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Journal Article
Interface fracture properties of thin films studied by using the micro-cantilever deflection technique
Matoy, Kurt, Detzel, Thomas, Müller, Matthias, Motz, Christian, Dehm, Gerhard
Published in Surface & coatings technology (25.12.2009)
Published in Surface & coatings technology (25.12.2009)
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Journal Article
Conference Proceeding
Uniaxially aligned poly[(9,9-dioctylfluorenyl-2,7-diyl)-co-bithiophene] thin films characterized by the X-ray diffraction pole figure technique
Werzer, Oliver, Matoy, Kurt, Smilgies, Detlef-M, Rothmann, Michael M, Strohriegl, Peter, Resel, Roland
Published in Journal of applied polymer science (05.02.2008)
Published in Journal of applied polymer science (05.02.2008)
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Journal Article
Micron-sized fracture experiments on amorphous SiOx films and SiOx/SiNx multi-layers
Matoy, Kurt, Schönherr, Helmut, Detzel, Thomas, Dehm, Gerhard
Published in Thin solid films (02.08.2010)
Published in Thin solid films (02.08.2010)
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Journal Article
Temperature treatment of semiconducting polymers: An X-ray reflectivity study
Werzer, Oliver, Matoy, Kurt, Strohriegl, Peter, Resel, Roland
Published in Thin solid films (23.05.2007)
Published in Thin solid films (23.05.2007)
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Journal Article
Conference Proceeding
Following crack path selection in multifilm structures with weak and strong interfaces by in situ 4-point-bending
Völker, Bernhard, Venkatesan, Sriram, Heinz, Walther, Matoy, Kurt, Roth, Roman, Batke, Jörg-Martin, Cordill, Megan J., Dehm, Gerhard
Published in Journal of materials research (28.04.2015)
Published in Journal of materials research (28.04.2015)
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Journal Article
Au–Sn solders applied in transient liquid phase bonding: Microstructure and mechanical behavior
Du, Chaowei, Soler, Rafael, Völker, Bernhard, Matoy, Kurt, Zechner, Johannes, Langer, Gregor, Reisinger, Michael, Todt, Juraj, Kirchlechner, Christoph, Dehm, Gerhard
Published in Materialia (01.12.2019)
Published in Materialia (01.12.2019)
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Journal Article
Semiconductor device including an integrated resistor and method of producing thereof
Matoy, Kurt, Ostermann, Thomas, Ahlers, Dirk, Brandl, Peter, Zundel, Markus
Year of Publication 23.03.2021
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Year of Publication 23.03.2021
Patent
Semiconductor Device Including an Integrated Resistor
Matoy, Kurt, Ostermann, Thomas, Ahlers, Dirk, Brandl, Peter, Zundel, Markus
Year of Publication 14.05.2020
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Year of Publication 14.05.2020
Patent
Semiconductor device including an integrated resistor
Matoy, Kurt, Ostermann, Thomas, Ahlers, Dirk, Brandl, Peter, Zundel, Markus
Year of Publication 10.03.2020
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Year of Publication 10.03.2020
Patent
Semiconductor Device Including an Integrated Resistor
Matoy, Kurt, Ostermann, Thomas, Ahlers, Dirk, Brandl, Peter, Zundel, Markus
Year of Publication 23.05.2019
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Year of Publication 23.05.2019
Patent