Flip-Chip Integration of InP and SiN
Theurer, M., Moehrle, M., Sigmund, A., Velthaus, K.-O., Oldenbeuving, R. M., Wevers, L., Postma, F. M., Mateman, R., Schreuder, F., Geskus, D., Worhoff, K., Dekker, R., Heideman, R. G., Schell, M.
Published in IEEE photonics technology letters (01.02.2019)
Published in IEEE photonics technology letters (01.02.2019)
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Journal Article
Actively Aligned Flip-Chip Integration of InP to SiN Utilizing Optical Backscatter Reflectometry
Theurer, M, Moehrle, M, Sigmund, A, Velthaus, K.-O, Oldenbeuving, R.M, Wevers, L, Postma, F.M, Mateman, R, Schreuder, F, Geskus, D, Wo¨rhoff, K, Dekker, R, Heideman, R.G, Schell, M
Published in 45th European Conference on Optical Communication (ECOC 2019) (2019)
Published in 45th European Conference on Optical Communication (ECOC 2019) (2019)
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Conference Proceeding
Analysis systems for the detection of ammonia based on micromachined components modular hybrid versus monolithic integrated approach
Tiggelaar, Roald M, Veenstra, Theo T, Sanders, Remco G.P, Berenschot, Erwin, Gardeniers, Han, Elwenspoek, Miko, Prak, Albert, Mateman, Richard, Wissink, Jeroen M, van den Berg, Albert
Published in Sensors and actuators. B, Chemical (01.07.2003)
Published in Sensors and actuators. B, Chemical (01.07.2003)
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Journal Article