Design and Fabrication of Broadband Polymer Mode (De)Multiplexer Using a Direct Inscribing Method
Xiao Xu, Lin Ma, Marushima, Chinami, Ishigure, Takaaki, Zuyuan He
Published in IEEE photonics journal (01.12.2018)
Published in IEEE photonics journal (01.12.2018)
Get full text
Journal Article
Direct Fabrication for Polymer Optical Waveguide in PMT Ferrule Using the Mosquito Method
Ishigure, Takaaki, Masuda, Hikaru, Date, Kumi, Marushima, Chinami, Enomoto, Tadayuki
Published in 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) (01.05.2018)
Published in 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) (01.05.2018)
Get full text
Conference Proceeding
Analysis of process dependent mechanical properties of sintered copper nanoparticle pillars for the plating-free bumping by finite element method
Kohara, Sayuri, Aoki, Toyohiro, Marushima, Chinami, Taylor, Christine, Sueoka, Kuniaki, Hisada, Takashi
Published in 2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm) (31.05.2022)
Published in 2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm) (31.05.2022)
Get full text
Conference Proceeding
METHOD FOR MANUFACTURING GI OPTICAL WAVEGUIDE
NAGASAWA, Takehiro, MARUSHIMA, Chinami, ISHIGURE, Takaaki, SAITO, Yuki
Year of Publication 02.08.2018
Get full text
Year of Publication 02.08.2018
Patent
Direct Fabrication for Multimode/Single-mode Polymer Optical Waveguides on Printed Circuit Board using the Mosquito Method
MARUSHIMA, Chinami, ISHIGURE, Takaaki
Published in 2018 IEEE CPMT Symposium Japan (ICSJ) (01.11.2018)
Published in 2018 IEEE CPMT Symposium Japan (ICSJ) (01.11.2018)
Get full text
Conference Proceeding
Thermomechanical Analysis on Stress Mitigation of FCPBGA with Low Melting Temperature Solder and Low Elastic Modulus Cu Pillar
Hisada, Takashi, Kohara, Sayuri, Marushima, Chinami, Aoki, Toyohiro
Published in 2022 International Conference on Electronics Packaging (ICEP) (11.05.2022)
Published in 2022 International Conference on Electronics Packaging (ICEP) (11.05.2022)
Get full text
Conference Proceeding
CFD Simulation Analysis and Experimental Study of Capillary Underfill Flow in Heterogeneous Integration
Miyazawa, Risa, Marushima, Chinami, Aoki, Toyohiro, Horibe, Akihiro, Hisada, Takashi
Published in 2021 IEEE 71st Electronic Components and Technology Conference (ECTC) (01.06.2021)
Published in 2021 IEEE 71st Electronic Components and Technology Conference (ECTC) (01.06.2021)
Get full text
Conference Proceeding
Underfill vacuum process
Risa Miyazawa, Akihiro Horibe, Toyohiro Aoki, Chinami Marushima, Takashi Hisada
Year of Publication 28.08.2024
Get full text
Year of Publication 28.08.2024
Patent
TRENCH STRUCTURE FOR SEMICONDUCTOR DEVICE
Bergendahl, Marc A, Aoki, Toyohiro, Hisada, Takashi, Marushima, Chinami
Year of Publication 04.04.2024
Get full text
Year of Publication 04.04.2024
Patent
Dimensional Parameters Controlling Capillary Underfill Flow for Void-Free Encapsulation of a Direct Bonded Heterogeneous Integration (DBHi) Si-bridge Package
Marushima, Chinami, Aoki, Toyohiro, Nakamura, Koki, Miyazawa, Risa, Horibe, Akihiro, de Sousa, Isabel, Sikka, Kamal, Hisada, Takashi
Published in 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) (01.05.2022)
Published in 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) (01.05.2022)
Get full text
Conference Proceeding
Morphology and Mechanical property of Cu pillar formed by sintered Cu nanoparticles for the plating-free bumping process
Marushima, Chinami, Aoki, Toyohiro, Kohara, Sayuri, Yamaguchi, Ryota, Sekine, Nobuhiro, Yatsugi, Kenichi, Sueoka, Kuniaki, Hisada, Takashi
Published in 2021 International Conference on Electronics Packaging (ICEP) (12.05.2021)
Published in 2021 International Conference on Electronics Packaging (ICEP) (12.05.2021)
Get full text
Conference Proceeding
Scalable Advanced DBHi Chiplet Package Using Silicon Bridge With 30 µm-Pitch Solder Joints
Horibe, Akihiro, Watanabe, Takahito, Marushima, Chinami, Kohara, Sayuri, Yamada, Yasuharu, Mori, Hiroyuki, Taneja, Divya, Pilger, Katherine, Jacques-Fortin, Alexis, Godard, Maxime, Chen, Qianwen, Perfecto, Eric, Jain, Aakrati, Ross, Joseph R, Wassick, Thomas, De Sousa, Isabel
Published in 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) (28.05.2024)
Published in 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) (28.05.2024)
Get full text
Conference Proceeding
Super Fine Jet Underfill Dispense Technique for Robust Micro Joint in Direct Bonded Heterogeneous Integration (DBHi) Silicon Bridge Packages
Horibe, Akihiro, Marushima, Chinami, Watanabe, Takahito, Jain, Aakrati, Turcotte, Eric, de Sousa, Isabel, Sikka, Kamal, Hisada, Takashi
Published in 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) (01.05.2022)
Published in 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) (01.05.2022)
Get full text
Conference Proceeding
MULTICHIP INTERCONNECT PACKAGE FINE JET UNDERFILL
Horibe, Akihiro, Hisada, Takashi, Marushima, Chinami, Watanabe, Takahito
Year of Publication 28.09.2023
Get full text
Year of Publication 28.09.2023
Patent
MULTICHIP INTERCONNECT PACKAGE
MARUSHIMA, CHINAMI, Horibe, Akihiro, Aoki, Toyohiro, Hisada, Takashi, Watanabe, Takahito
Year of Publication 28.09.2023
Get full text
Year of Publication 28.09.2023
Patent
Surface Silicon Bridge Direct Bonded Heterogeneous Integration (s-DBHi)
Sikka, Kamal, Sousa, Isabel De, Jain, Aakrati, Marushima, Chinami, Aoki, Toyohiro, Kohara, Sayuri, Mori, Hiroyuki, Hisada, Takashi
Published in 2022 6th IEEE Electron Devices Technology & Manufacturing Conference (EDTM) (06.03.2022)
Published in 2022 6th IEEE Electron Devices Technology & Manufacturing Conference (EDTM) (06.03.2022)
Get full text
Conference Proceeding
UNDERFILL VACUUM PROCESS
HORIBE, Akihiro, HISADA, Takashi, MIYAZAWA, Risa, MARUSHIMA, Chinami, AOKI, Toyohiro
Year of Publication 15.06.2023
Get full text
Year of Publication 15.06.2023
Patent
UNDERFILL VACUUM PROCESS
MARUSHIMA, CHINAMI, Aoki, Toyohiro, Horibe, Akihiro, Hisada, Takashi, MIYAZAWA, RISA
Year of Publication 08.06.2023
Get full text
Year of Publication 08.06.2023
Patent
Plating-free Bumping by Cu Nanopaste and Injection Molded Solder (IMS) for Fine Pitch Flip Chip Joining
Aoki, Toyohiro, Nakamura, Eiji, Kohara, Sayuri, Marushima, Chinami, Sueoka, Kuniaki, Hisada, Takashi, Yamaguchi, Ryota, Sekine, Nobuhiro, Yatsugi, Kenichi, Yada, Makoto
Published in 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) (01.06.2020)
Published in 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) (01.06.2020)
Get full text
Conference Proceeding