Texture development in polycrystalline CrN coatings: the role of growth conditions and a Cr interlayer
Daniel, R, Martinschitz, K J, Keckes, J, Mitterer, C
Published in Journal of physics. D, Applied physics (07.04.2009)
Published in Journal of physics. D, Applied physics (07.04.2009)
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Journal Article
Elastic constants of fibre-textured thin films determined by X-ray diffraction
Martinschitz, K. J., Daniel, R., Mitterer, C., Keckes, J.
Published in Journal of applied crystallography (01.06.2009)
Published in Journal of applied crystallography (01.06.2009)
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Journal Article
Residual stresses in thermally cycled CrN coatings on steel
Kirchlechner, C., Martinschitz, K.J., Daniel, R., Mitterer, C., Keckes, J.
Published in Thin solid films (01.12.2008)
Published in Thin solid films (01.12.2008)
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Journal Article
Conference Proceeding
Size-independent stresses in Al thin films thermally strained down to −100 °C
Eiper, E., Keckes, J., Martinschitz, K.J., Zizak, I., Cabié, M., Dehm, G.
Published in Acta materialia (01.04.2007)
Published in Acta materialia (01.04.2007)
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Journal Article
Rapid determination of stress factors and absolute residual stresses in thin films
Eiper, E., Martinschitz, K. J., Massl, S., Köstenbauer, H., Daniel, R., Fontalvo, G., Mitterer, C., Keckes, J.
Published in Journal of applied crystallography (01.12.2006)
Published in Journal of applied crystallography (01.12.2006)
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Journal Article
In-Situ X-ray Diffraction as a Tool to Probe Mechanical Phenomena Down to the Nano-Scale
Keckes, J., Eiper, E., Martinschitz, K. J., Boesecke, P., Gindl, W., Dehm, G.
Published in Advanced engineering materials (01.11.2006)
Published in Advanced engineering materials (01.11.2006)
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Journal Article
X-ray diffraction analysis of three-dimensional residual stress fields reveals origins of thermal fatigue in uncoated and coated steel
Kirchlechner, C., Martinschitz, K.J., Daniel, R., Mitterer, C., Donges, J., Rothkirch, A., Klaus, M., Genzel, C., Keckes, J.
Published in Scripta materialia (01.05.2010)
Published in Scripta materialia (01.05.2010)
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Journal Article
Size-independent stresses in Al thin films thermally strained down to -100 super(o)C
Eiper, E, Keckes, J, Martinschitz, K J, Zizak, I, Cabie, M, Dehm, G
Published in Acta materialia (01.04.2007)
Published in Acta materialia (01.04.2007)
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Journal Article
Size-independent stresses in Al thin films thermally strained down to -100 deg C
Eiper, E, Keckes, J, Martinschitz, K J, Zizak, I, Cabie, M, Dehm, G
Published in Acta materialia (01.04.2007)
Published in Acta materialia (01.04.2007)
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Journal Article
Thermal Stresses and Microstructure of Tungsten Films on Copper
Kapp, M., Martinschitz, K. J., Keckes, J., Lackner, J. M., Zizak, I., Dehm, G.
Published in BHM. Berg- und hüttenmännische Monatshefte (01.07.2008)
Published in BHM. Berg- und hüttenmännische Monatshefte (01.07.2008)
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Journal Article
3D embedded wafer-level packaging technology development for smart card SIP application
Pares, G., Bouvier, C., Saadaoui, M., Mazuir, J., Noiray, J., Martinschitz, K., Planchais, A., Simon, G.
Published in 2012 IEEE 14th Electronics Packaging Technology Conference (EPTC) (01.12.2012)
Published in 2012 IEEE 14th Electronics Packaging Technology Conference (EPTC) (01.12.2012)
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Conference Proceeding
Full integration of a 3D demonstrator with TSV first interposer, ultra thin die stacking and wafer level packaging
Pares, G., Karoui, C., Zaid, A., Dosseul, F., Feron, M., Attard, A., Klug, G., Luesebrink, H., Martinschitz, K., Launay, N., Belhenini, S., Simon, G.
Published in 2013 IEEE 63rd Electronic Components and Technology Conference (01.05.2013)
Published in 2013 IEEE 63rd Electronic Components and Technology Conference (01.05.2013)
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Conference Proceeding
Demonstration of a 3D embedded wafer-level SIP for smartcard application
Pares, G., Bouvier, C., Castagne, L., Saadaoui, M., Mazuir, J., Noiray, J., Martinschitz, K., Mercier, L., Planchais, A., Simon, G.
Published in 2013 Eurpoean Microelectronics Packaging Conference (EMPC) (01.09.2013)
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Published in 2013 Eurpoean Microelectronics Packaging Conference (EMPC) (01.09.2013)
Conference Proceeding