Conductive Semiconductor Interfaces Fabricated by Room Temperature Covalent Wafer Bonding
Flötgen, Christoph, Razek, Nasser, Dragoi, Viorel, Wimplinger, Markus
Published in ECS transactions (24.08.2016)
Published in ECS transactions (24.08.2016)
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Journal Article
Low-Temperature Cu-Cu Wafer Bonding
Rebhan, Bernhard, Hesser, Günter, Duchoslav, Jiri, Dragoi, Viorel, Wimplinger, Markus, Hingerl, Kurt
Published in ECS transactions (15.03.2013)
Published in ECS transactions (15.03.2013)
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Journal Article
III–V-on-silicon solar cells reaching 33% photoconversion efficiency in two-terminal configuration
Cariou, Romain, Benick, Jan, Feldmann, Frank, Höhn, Oliver, Hauser, Hubert, Beutel, Paul, Razek, Nasser, Wimplinger, Markus, Bläsi, Benedikt, Lackner, David, Hermle, Martin, Siefer, Gerald, Glunz, Stefan W., Bett, Andreas W., Dimroth, Frank
Published in Nature energy (01.04.2018)
Published in Nature energy (01.04.2018)
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Journal Article
Inline Bondwave Monitoring for Direct Bonding, Process Optimization and Impact on Post-Bond Distortion
Michaud, Laurent Gaëtan, Fournel, Frank, Morales, Christophe, Schmidbauer, Martin, Abadie, Karine, Plach, Thomas, Wimplinger, Markus
Published in ECS transactions (29.09.2023)
Published in ECS transactions (29.09.2023)
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Journal Article
Monolithic Two-Terminal III–V//Si Triple-Junction Solar Cells With 30.2% Efficiency Under 1-Sun AM1.5g
Cariou, Romain, Benick, Jan, Beutel, Paul, Razek, Nasser, Flotgen, Christoph, Hermle, Martin, Lackner, David, Glunz, Stefan W., Bett, Andreas W., Wimplinger, Markus, Dimroth, Frank
Published in IEEE journal of photovoltaics (01.01.2017)
Published in IEEE journal of photovoltaics (01.01.2017)
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Journal Article
Influencing factors in high precision fusion wafer bonding for monolithic integration
Uhrmann, Thomas, Kurz, Florian, Plach, Thomas, Wagenleitner, Thomas, Dragoi, Viorel, Wimplinger, Markus, Lindner, Paul
Published in 2015 IEEE 65th Electronic Components and Technology Conference (ECTC) (01.05.2015)
Published in 2015 IEEE 65th Electronic Components and Technology Conference (ECTC) (01.05.2015)
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Conference Proceeding
Thin Layer Transfer Using Room Temperature Wafer-Level Bonding Process
Abadie, Karine, Fournel, Frank, Morales, Christophe, Moriceau, Hubert, Wimplinger, Markus
Published in ECS transactions (24.08.2016)
Published in ECS transactions (24.08.2016)
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Journal Article
(Invited) High Accuracy Aligned Wafer Bonding for Wafer-Level Integration
Plach, Thomas, Rebhan, Bernhard, Dragoi, Viorel, Wagenleitner, Thomas, Wimplinger, Markus, Lindner, Paul
Published in ECS transactions (20.07.2018)
Published in ECS transactions (20.07.2018)
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Journal Article
Novel Surface Preparation Methods for Covalent and Conductive Bonded Interfaces Fabrication
Flötgen, Christoph, Razek, Nasser, Dragoi, Viorel, Wimplinger, Markus
Published in ECS transactions (14.08.2014)
Published in ECS transactions (14.08.2014)
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Journal Article
A full-process chain assessment for nanoimprint technology on 200-mm industrial platform
Teyssedre, Hubert, Landis, Stefan, Thanner, Christine, Laure, Maria, Khan, Jonas, Bos, Sandra, Eibelhuber, Martin, Chouiki, Mustapha, May, Michael, Brianceau, Pierre, Pollet, Olivier, Hazart, Jerome, Laviron, Cyrille, Pain, Laurent, Wimplinger, Markus
Published in Advanced optical technologies (27.06.2017)
Published in Advanced optical technologies (27.06.2017)
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Journal Article
Monolithic IC integration key alignment aspects for high process yield
Uhrmann, Thomas, Wagenleitner, Thomas, Glinsner, Thomas, Wimplinger, Markus, Lindner, Paul
Published in 2014 SOI-3D-Subthreshold Microelectronics Technology Unified Conference (S3S) (01.10.2014)
Published in 2014 SOI-3D-Subthreshold Microelectronics Technology Unified Conference (S3S) (01.10.2014)
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Conference Proceeding