Search Results - "Markovich, Voya R." :: K.UTB vyhledávací portál

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Fabrication, integration and reliability of nanocomposite based embedded capacitors in microelectronics packaging

by DAS, Rabindra N, LAUFFER, John M, MARKOVICH, Voya R
Published in Journal of materials chemistry (01.01.2008)

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Journal Article

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Printable electronics: towards materials development and device fabrication

by Das, Rabindra N., Lin, How T., Lauffer, John M., Markovich, Voya R.
Published in Circuit world (01.01.2011)

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Journal Article

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Nano- and micro-filled conducting adhesives for z-axis interconnections: new direction for high-speed, high-density, organic microelectronics packaging

by Das, Rabindra N., Egitto, Frank D., Markovich, Voya R.
Published in Circuit world (08.02.2008)

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Laser processing of materials: a new strategy toward materials design and fabrication for electronic packaging

by Das, Rabindra N., Egitto, Frank D., Markovich, Voya R.
Published in Circuit world (18.05.2010)

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Journal Article

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Resin coated copper capacitive (RC3) nanocomposites for multilayer embedded capacitors: towards system in a package (SiP)

by Das, Rabindra N., Rosser, Steven G., Papathomas, Konstantinos I., Antesberger, Tim, Markovich, Voya R.
Published in Circuit world (20.11.2009)

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Journal Article

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Laser Micromachining of Barium Titanate (})-Epoxy Nanocomposite-Based Flexible/Rollable Capacitors: New Approach for Making Library of Capacitors

by Das, R.N., Egitto, F.D., Lauffer, J.M., Markovich, V.R.
Published in IEEE transactions on electronics packaging manufacturing (01.04.2008)

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Journal Article

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Development of rigid-flex and multilayer flex for electronic packaging

by Das, Rabindra N, Egitto, Frank D, Wilson, Bill, Poliks, Mark D, Markovich, Voya R
Published in 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) (01.06.2010)

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Conference Proceeding

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Nanofluids, nanogels and nanopastes for electronic packaging

by Das, Rabindra N, Calmidi, Varaprasad, Poliks, Mark D, Markovich, Voya R
Published in 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) (01.06.2010)

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Conference Proceeding

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MULTI-LAYER INTERCONNECTION STRUCTURE USING AN LCP DIELECTRIC

by FARQUHAR DONALD S, POLIKS MARK D, EGITTO FRANK D, POWELL DOUGLAS O, MARKOVICH VOYA R
Year of Publication 13.04.2004

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Patent

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Resin coated copper capacitive RC3 nanocomposites for multilayer embedded capacitors towards system in a package SiP

by Das, Rabindra N., Rosser, Steven G., Papathomas, Konstantinos I., Antesberger, Tim, Markovich, Voya R.
Published in Circuit world (20.11.2009)

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Journal Article

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Nano and microfilled conducting adhesives for zaxis interconnections new direction for highspeed, highdensity, organic microelectronics packaging

by Das, Rabindra N., Egitto, Frank D., Markovich, Voya R.
Published in Circuit world (08.02.2008)

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Journal Article

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Nanomaterials for Electronic Packaging: Toward Extreme Miniaturization [Nanopackaging]

by Das, R N, Markovich, V R
Published in IEEE nanotechnology magazine (01.12.2010)

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Magazine Article

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Method of making a circuitized substrate

by Das Rabindra N, Papathomas Kostas I, Markovich Voya R
Year of Publication 05.09.2017

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Patent

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Package-Interposer-Package (PIP): A breakthrough Package-on-Package (PoP) technology for high end electronics

by Das, R. N., Egitto, F. D., Bonitz, B., Poliks, M. D., Markovich, V. R.
Published in 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) (01.05.2011)

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Conference Proceeding