A DfT Architecture for 3D-SICs Based on a Standardizable Die Wrapper
Marinissen, Erik Jan, Chi, Chun-Chuan, Konijnenburg, Mario, Verbree, Jouke
Published in Journal of electronic testing (01.02.2012)
Published in Journal of electronic testing (01.02.2012)
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Journal Article
On-Chip Toggle Generators to Provide Realistic Conditions during Test of Digital 2D-SoCs and 3D-SICs
Katselas, Leonidas, Hatzopoulos, Alkis, Jiao, Hailong, Papameletis, Christos, Marinissen, Erik Jan
Published in 2018 IEEE International Test Conference (ITC) (01.10.2018)
Published in 2018 IEEE International Test Conference (ITC) (01.10.2018)
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Conference Proceeding
Solutions to Multiple Probing Challenges for Test Access to Multi-Die Stacked Integrated Circuits
Marinissen, Erik Jan, Fodor, Ferenc, Podpod, Arnita, Stucchi, Michele, Jian, Yu-Rong, Wu, Cheng-Wen
Published in 2018 IEEE International Test Conference (ITC) (01.10.2018)
Published in 2018 IEEE International Test Conference (ITC) (01.10.2018)
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Conference Proceeding
A fully automatic test system for characterizing large-array fine-pitch micro-bump probe cards
Marinissen, Erik Jan, Fodor, Ferenc, De Wachter, Bart, Kiesewetter, Jorg, Hill, Eric, Smith, Ken
Published in 2017 International Test Conference in Asia (ITC-Asia) (01.09.2017)
Published in 2017 International Test Conference in Asia (ITC-Asia) (01.09.2017)
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Conference Proceeding
Optimization methods for post-bond die-internal/external testing in 3D stacked ICs
Noia, B, Chakrabarty, K, Marinissen, E J
Published in 2010 IEEE International Test Conference (01.11.2010)
Published in 2010 IEEE International Test Conference (01.11.2010)
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Conference Proceeding
Evaluation of TSV and micro-bump probing for wide I/O testing
Smith, K., Hanaway, P., Jolley, M., Gleason, R., Strid, E., Daenen, T., Dupas, L., Knuts, B., Marinissen, E. J., Van Dievel, M.
Published in 2011 IEEE International Test Conference (01.09.2011)
Published in 2011 IEEE International Test Conference (01.09.2011)
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Conference Proceeding
DfT architecture and ATPG for Interconnect tests of JEDEC Wide-I/O memory-on-logic die stacks
Deutsch, S., Keller, B., Chickermane, V., Mukherjee, S., Sood, N., Goel, S. K., Chen, J., Mehta, A., Lee, F., Marinissen, E. J.
Published in 2012 IEEE International Test Conference (01.11.2012)
Published in 2012 IEEE International Test Conference (01.11.2012)
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Conference Proceeding
IEEE Standard 1838 Is on the Move
Cron, Adam, Marinissen, Erik Jan, Mariani, Riccardo
Published in Computer (Long Beach, Calif.) (01.11.2021)
Published in Computer (Long Beach, Calif.) (01.11.2021)
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Journal Article
Study of Transistor Metrics for Room-Temperature Screening of Single Electron Transistors for Silicon Spin Qubit Applications
Lorenzelli, Francesco, Elsayed, Asser, Godfrin, Clement, Grill, Alexander, Kubicek, Stefan, Li, Ruoyu, Stucchi, Michele, Wan, Danny, De Greve, Kristiaan, Jan Marinissen, Erik, Gielen, Georges
Published in 2023 IEEE European Test Symposium (ETS) (22.05.2023)
Published in 2023 IEEE European Test Symposium (ETS) (22.05.2023)
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Conference Proceeding
Challenges and emerging solutions in testing TSV-based 2 1/2D- and 3D-stacked ICs
Marinissen, Erik Jan
Published in Proceedings of the Conference on Design, Automation and Test in Europe (12.03.2012)
Published in Proceedings of the Conference on Design, Automation and Test in Europe (12.03.2012)
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Conference Proceeding
Understanding The Transistor Behavior of Electron-Spin Qubits Above Cryogenic Temperatures
Lorenzelli, Francesco, Godfrin, Clement, Stucchi, Michele, Grill, Alexander, Li, Ruoyu, Wan, Danny, Greve, Kristiaan De, Marinissen, Erik Jan, Gielen, Georges
Published in IEEE electron device letters (17.09.2024)
Published in IEEE electron device letters (17.09.2024)
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Journal Article
MFA-MTJ Model: Magnetic-Field-Aware Compact Model of pMTJ for Robust STT-MRAM Design
Wu, Lizhou, Rao, Siddharth, Taouil, Mottaqiallah, Marinissen, Erik Jan, Kar, Gouri Sankar, Hamdioui, Said
Published in IEEE transactions on computer-aided design of integrated circuits and systems (01.11.2022)
Published in IEEE transactions on computer-aided design of integrated circuits and systems (01.11.2022)
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Journal Article
Testing TSV-based three-dimensional stacked ICs
Marinissen, Erik Jan
Published in 2010 Design, Automation & Test in Europe Conference & Exhibition (DATE 2010) (01.03.2010)
Published in 2010 Design, Automation & Test in Europe Conference & Exhibition (DATE 2010) (01.03.2010)
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Conference Proceeding