Incorporating the role of stress on electromigration in power grids with via arrays
Mishra, Vivek, Jain, Palkesh, Marella, Sravan K., Sapatnekar, Sachin S.
Published in 2017 54th ACM/EDAC/IEEE Design Automation Conference (DAC) (01.06.2017)
Published in 2017 54th ACM/EDAC/IEEE Design Automation Conference (DAC) (01.06.2017)
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Conference Proceeding
A holistic analysis of circuit timing variations in 3D-ICs with thermal and TSV-induced stress considerations
Marella, Sravan K., Kumar, Sanjay V., Sapatnekar, Sachin S.
Published in 2012 IEEE/ACM International Conference on Computer-Aided Design (ICCAD) (05.11.2012)
Published in 2012 IEEE/ACM International Conference on Computer-Aided Design (ICCAD) (05.11.2012)
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Conference Proceeding
Circuit reliability: from physics to architectures
Fang, Jianxin, Gupta, Saket, Kumar, Sanjay V., Marella, Sravan K., Mishra, Vivek, Zhou, Pingqiang, Sapatnekar, Sachin S.
Published in Proceedings of the International Conference on Computer-Aided Design (05.11.2012)
Published in Proceedings of the International Conference on Computer-Aided Design (05.11.2012)
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Conference Proceeding
The impact of shallow trench isolation effects on circuit performance
Marella, Sravan K., Sapatnekar, Sachin S.
Published in 2013 IEEE/ACM International Conference on Computer-Aided Design (ICCAD) (01.11.2013)
Published in 2013 IEEE/ACM International Conference on Computer-Aided Design (ICCAD) (01.11.2013)
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Conference Proceeding
Circuit reliability: From Physics to Architectures: Embedded tutorial paper
Jianxin Fang, Gupta, S., Kumar, S. V., Marella, S. K., Mishra, V., Pingqiang Zhou, Sapatnekar, S. S.
Published in 2012 IEEE/ACM International Conference on Computer-Aided Design (ICCAD) (01.11.2012)
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Published in 2012 IEEE/ACM International Conference on Computer-Aided Design (ICCAD) (01.11.2012)
Conference Proceeding