Heterogeneous Integration at Fine Pitch (≤ 10 µm) Using Thermal Compression Bonding
Bajwa, Adeel A., Jangam, SivaChandra, Pal, Saptadeep, Marathe, Niteesh, Tingyu Bai, Fukushima, Takafumi, Goorsky, Mark, Iyer, Subramanian S.
Published in 2017 IEEE 67th Electronic Components and Technology Conference (ECTC) (01.05.2017)
Published in 2017 IEEE 67th Electronic Components and Technology Conference (ECTC) (01.05.2017)
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