Robust spin-on glass gap-fill process technology for sub-30nm interlayer dielectrics
Kyung-Mun Byun, Deok-Young Jung, Jun-Won Lee, Seungheon Lee, Hyongsoo Kim, Mun-Jun Kim, Eunkee Hong, Mansug Gang, Seok-Woo Nam, Joo-Tae Moon, Chilhee Chung, Jung-Hoo Lee, Hyo-Sug Lee
Published in 2010 IEEE International Interconnect Technology Conference (01.06.2010)
Published in 2010 IEEE International Interconnect Technology Conference (01.06.2010)
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