HLA genetics in bipolar disorder
Tamouza, R., Oliveira, J., Etain, B., Bengoufa, D., Hamdani, N., Manier, C., Mariaselvam, C., Sundaresh, A., Bellivier, F., Henry, C., Kahn, J‐P., Krishnamoorthy, R., Charron, D., Leboyer, M.
Published in Acta psychiatrica Scandinavica (01.11.2018)
Published in Acta psychiatrica Scandinavica (01.11.2018)
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Journal Article
Carboneous coatings by rolling with 10% slip under mixed/boundary lubrication and high initial Hertzian contact pressures
Manier, C.-A., Spaltmann, D., Theiler, G., Woydt, M.
Published in Diamond and related materials (01.07.2008)
Published in Diamond and related materials (01.07.2008)
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Journal Article
Conference Proceeding
Slip-rolling resistance of high performance thin films and high toughness steel substrates under extreme conditions
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Conference Proceeding
Journal Article
Application of TSV integration and wafer bonding technologies for hermetic wafer level packaging of MEMS components for miniaturized timing devices
Zoschke, K., Manier, C.-A, Wilke, M., Oppermann, H., Ruffieux, D., Dekker, J., Jaakkola, A., Dalla Piazza, S., Allegato, G., Lang, K.-D
Published in 2015 IEEE 65th Electronic Components and Technology Conference (ECTC) (01.05.2015)
Published in 2015 IEEE 65th Electronic Components and Technology Conference (ECTC) (01.05.2015)
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Conference Proceeding
Transient thermal storage of excess heat using eutectic BiSn as phase change material for the thermal management of an electronic power module: design, technology, performance and reliability within a system approach
Wunderle, B., Springborn, M., May, D., Heilmann, J., Manier, C. -A., Ras, M. Abo, Oppermann, H., Sarkany, Z., Mitova, R.
Published in 2018 24rd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) (01.09.2018)
Published in 2018 24rd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) (01.09.2018)
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Conference Proceeding
Thermal management of electrical overload cases using thermo-electric modules and phase change buffer techniques: Simulation, technology and testing
Springborn, M., Wunderle, B., May, D., Mrossko, R., Manier, C.-A, Oppermann, H., Ras, M. Abo, Mitova, R.
Published in 2014 15th International Conference on Thermal, Mechanical and Mulit-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) (01.04.2014)
Published in 2014 15th International Conference on Thermal, Mechanical and Mulit-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) (01.04.2014)
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Conference Proceeding
Hermetic wafer level packaging of MEMS components using through silicon via and wafer to wafer bonding technologies
Zoschke, K., Manier, C.-A, Wilke, M., Jurgensen, N., Oppermann, H., Ruffieux, D., Dekker, J., Heikkinen, Hannele, Dalla Piazza, S., Allegato, G., Lang, K.-D
Published in 2013 IEEE 63rd Electronic Components and Technology Conference (01.05.2013)
Published in 2013 IEEE 63rd Electronic Components and Technology Conference (01.05.2013)
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Conference Proceeding
Capping technologies for wafer level MEMS packaging based on permanent and temporary wafer bonding
Zoschke, K., Wilke, M., Wegner, M., Kaletta, K., Manier, C.-A, Oppermann, H., Wietstruck, M., Tillack, B., Kaynak, M., Lang, K.-D
Published in 2014 IEEE 64th Electronic Components and Technology Conference (ECTC) (01.05.2014)
Published in 2014 IEEE 64th Electronic Components and Technology Conference (ECTC) (01.05.2014)
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Conference Proceeding
Transient thermal management by using double-sided assembling, thermo-electric cooling and phase-change based thermal buffer structures: Design, technology and application
Springborn, M., Wunderle, B., May, D., Mrossko, R., Manier, C.-A, Ras, M. Abo, Oppermann, H., Xhonneux, T., Caroff, T., Mitova, R.
Published in 2015 21st International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) (01.09.2015)
Published in 2015 21st International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) (01.09.2015)
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Conference Proceeding
P.1.a.030 - Distribution of C4 copy number variations in bipolar disorder, schizophrenia and systemic lupus erythematosus
Mariaselvam, C.M., Sundaresh, A., Bennabi, M., Manier, C., Krishnamoorthy, R., Leboyer, M., Negi, V.S., Tamouza, R.
Published in European neuropsychopharmacology (01.10.2017)
Published in European neuropsychopharmacology (01.10.2017)
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Journal Article
Distribution of C4 copy number variations in bipolar disorder, schizophrenia and systemic lupus erythematosus
Mariaselvam, C.M., Sundaresh, A., Bennabi, M., Manier, C., Krishnamoorthy, R., Leboyer, M., Negi, V.S., Tamouza, R.
Published in European neuropsychopharmacology (01.10.2017)
Published in European neuropsychopharmacology (01.10.2017)
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Journal Article
Phase change based thermal buffering of transient loads for power converter
Wunderle, B., Springborn, M., May, D., Mrossko, R., Ras, M. Abo, Manier, C.-A, Oppermann, H., Mitova, R.
Published in 20th International Workshop on Thermal Investigations of ICs and Systems (01.09.2014)
Published in 20th International Workshop on Thermal Investigations of ICs and Systems (01.09.2014)
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Conference Proceeding
Wafer level 3D system integration based on silicon interposers with through silicon vias
Zoschke, K., Oppermann, H., Manier, C.-A, Ndip, I., Puschmann, R., Ehrmann, O., Wolf, J., Lang, Klaus-Dieter
Published in 2012 IEEE 14th Electronics Packaging Technology Conference (EPTC) (01.12.2012)
Published in 2012 IEEE 14th Electronics Packaging Technology Conference (EPTC) (01.12.2012)
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Conference Proceeding
Double-sided cooling and transient thermo-electrical management of Silicon on DCB assemblies for power converter modules: Design, technology and test
Wunderle, B., Springborn, M., May, D., Manier, C.-A, Abo Ras, M., Mrossko, R., Oppermann, H., Xhonneux, T., Caroff, T., Maurer, W., Mitova, R.
Published in Fourteenth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) (01.05.2014)
Published in Fourteenth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) (01.05.2014)
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Conference Proceeding
HLA Polymorphism in Regressive and Non-Regressive Autism: A Preliminary Study
Tamouza, Ryad, Fernell, Elisabeth, Eriksson, Mats Anders, Anderlid, Britt-Marie, Manier, Céline, Mariaselvam, Christina Mary, Boukouaci, Wahid, Leboyer, Marion, Gillberg, Christopher
Published in Autism research (01.02.2020)
Published in Autism research (01.02.2020)
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Journal Article
Essential fatty acids interconversion in the human fetal liver
Chambaz, J, Ravel, D, Manier, M C, Pepin, D, Mulliez, N, Bereziat, G
Published in Biology of the neonate (01.01.1985)
Published in Biology of the neonate (01.01.1985)
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Journal Article
β2-microglobulin: a biomarker for bipolar disorder and schizophrenia?
Sayous, R., Manier, C., Hamdani, N., Bennabi, M., Mariaselvam, C., Gadel, R., Hebbache, C., Richard, J.R., Bellivier, F., Leboyer, M., Tamouza, R.
Published in European neuropsychopharmacology (01.10.2017)
Published in European neuropsychopharmacology (01.10.2017)
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Journal Article
P.1.f.023 - β2-microglobulin: a biomarker for bipolar disorder and schizophrenia?
Sayous, R., Manier, C., Hamdani, N., Bennabi, M., Mariaselvam, C., Gadel, R., Hebbache, C., Richard, J.R., Bellivier, F., Leboyer, M., Tamouza, R.
Published in European neuropsychopharmacology (01.10.2017)
Published in European neuropsychopharmacology (01.10.2017)
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Journal Article