Theoretical Study on the Thermal Decomposition Mechanism of Fe(EDTA) - and Fe(EDTMP)
Zhang, Kai, Wang, Zhan, Ma, Shuying, Wu, Chen, Zhao, Xiaoyang
Published in Molecules (Basel, Switzerland) (13.09.2024)
Published in Molecules (Basel, Switzerland) (13.09.2024)
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Journal Article
Spiro-thiophene derivatives as hole-transport materials for perovskite solar cells
Ma, Shuying, Zhang, Hua, Zhao, Ning, Cheng, Yibing, Wang, Mingkui, Shen, Yan, Tu, Guoli
Published in Journal of materials chemistry. A, Materials for energy and sustainability (01.01.2015)
Published in Journal of materials chemistry. A, Materials for energy and sustainability (01.01.2015)
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Journal Article
Development of Reliable, High Performance WLCSP for BSI CMOS Image Sensor for Automotive Application
Zhou, Tianshen, Ma, Shuying, Yu, Daquan, Li, Ming, Hang, Tao
Published in Sensors (Basel, Switzerland) (22.07.2020)
Published in Sensors (Basel, Switzerland) (22.07.2020)
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Journal Article
Decomposition and Decoupling Analysis of Carbon Emissions in Xinjiang Energy Base, China
Qin, Jiancheng, Gao, Lei, Tu, Weihu, He, Jing, Tang, Jingzhe, Ma, Shuying, Zhao, Xiaoyang, Zhu, Xingzhe, Brindha, Karthikeyan, Tao, Hui
Published in Energies (Basel) (01.08.2022)
Published in Energies (Basel) (01.08.2022)
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Journal Article
Gas-bearing prediction of deep reservoir based on DNN embeddings
Ma, Shuying, Cao, Junxing, Liu, Zhege, Jiang, Xudong, Su, Zhaodong, Xue, Ya-juan
Published in Frontiers in earth science (Lausanne) (19.04.2023)
Published in Frontiers in earth science (Lausanne) (19.04.2023)
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Journal Article
Study on the behaviors of impurities in cadmium zinc telluride
Wang, Tao, Jie, Wanqi, Zhang, Jijun, Yang, Ge, Zeng, Dongmei, Xu, Yadong, Ma, Shuying, Hua, Hui, He, Ke
Published in Journal of crystal growth (15.06.2007)
Published in Journal of crystal growth (15.06.2007)
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Journal Article
Embedded Silicon Fan-Out (eSiFO): A Promising Wafer Level Packaging Technology for Multi-chip and 3D System Integration
Shuying Ma, Jiao Wang, Fengxia Zheng, Zhiyi Xiao, Teng Wang, Daquan Yu
Published in 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) (01.05.2018)
Published in 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) (01.05.2018)
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Conference Proceeding
Development of three-dimensional wafer level chip scale packaging using via last TSV and UV laser releasable temporary bonding technologies
Wang, Chengqian, Zhang, Meng, Ming, Xuefei, Ma, Shuying, Yu, Daquan
Published in Microsystem technologies : sensors, actuators, systems integration (01.11.2021)
Published in Microsystem technologies : sensors, actuators, systems integration (01.11.2021)
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Journal Article
Predicting the ecotoxicity of ionic liquids towards Vibrio fischeri using genetic function approximation and least squares support vector machine
Ma, Shuying, Lv, Min, Deng, Fangfang, Zhang, Xiaoyun, Zhai, Honglin, Lv, Wenjuan
Published in Journal of hazardous materials (01.01.2015)
Published in Journal of hazardous materials (01.01.2015)
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Journal Article
HCFU inhibits cervical cancer cells growth and metastasis by inactivating Wnt/β-catenin pathway
Liu, Ping, Ma, Shuying, Liu, Hua, Han, Huazhen, Wang, Shanshan
Published in Journal of cellular biochemistry (12.12.2017)
Published in Journal of cellular biochemistry (12.12.2017)
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Journal Article
Analysis of DC Characteristics in PDSOI pMOSFETs Under the Combined Effect of NBTI and TID
Liu, Chunmei, Xiao, Zhiyi, Ma, Shuying, Bi, Dawei, Hu, Zhiyuan, Zhang, Zhengxuan, Zou, Shichang
Published in IEEE transactions on nuclear science (01.05.2022)
Published in IEEE transactions on nuclear science (01.05.2022)
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Journal Article
Reliability of Ultra-Thin Embedded Silicon Fan-Out (eSiFO) Package Directly Assembled on PCB for Mobile Applications
Cheng Chen, Teng Wang, Daquan Yu, Shuying Ma, Kai Zhu, Zhiyi Xiao, Lixi Wan
Published in 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) (01.05.2018)
Published in 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) (01.05.2018)
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Conference Proceeding
3D wafer level compression molding process development for image sensor package
Shuying Ma, Mengqiang Li, Zhiyi Xiao, Xiaohua Huang, Daquan Yu
Published in 2017 18th International Conference on Electronic Packaging Technology (ICEPT) (01.08.2017)
Published in 2017 18th International Conference on Electronic Packaging Technology (ICEPT) (01.08.2017)
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Conference Proceeding
Radiation-hardened silicon photonic passive devices on a 3 µm waveguide platform under gamma and proton irradiation
Zhou, Yue, Lv, Dongsheng, Bi, Dawei, Wu, Longsheng, Wang, Ruxueu, Ma, Shuying, Zhang, En Xia, Fleetwood, Daniel M., Wu, Aimin
Published in Optics express (09.05.2022)
Published in Optics express (09.05.2022)
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Journal Article
Spiro-fluorene based 3D donor towards efficient organic photovoltaics
Ma, Shuying, Fu, Yingying, Ni, Debin, Mao, Jian, Xie, Zhiyuan, Tu, Guoli
Published in Chemical communications (Cambridge, England) (18.12.2012)
Published in Chemical communications (Cambridge, England) (18.12.2012)
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Journal Article