Through-plane assembly of carbon fibers into 3D skeleton achieving enhanced thermal conductivity of a thermal interface material
Ma, Jiake, Shang, Tianyu, Ren, Linlin, Yao, Yimin, Zhang, Tao, Xie, Jinqi, Zhang, Baotan, Zeng, Xiaoliang, Sun, Rong, Xu, Jian-Bin, Wong, Ching-Ping
Published in Chemical engineering journal (Lausanne, Switzerland : 1996) (15.01.2020)
Published in Chemical engineering journal (Lausanne, Switzerland : 1996) (15.01.2020)
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Journal Article
Aligned-carbon-fibre/Silicone-rubber Composite with High Thermal Conductivity Fabricated by Double-stacked Electrostatic Flocking Method
Ye, Zhenqiang, Xu, Jianbin, Ma, Jiake, Sun, Rong, Zeng, Xiaoliang, Deng, Fei, Xin, Peipei, Zhang, Ling
Published in 2020 21st International Conference on Electronic Packaging Technology (ICEPT) (01.08.2020)
Published in 2020 21st International Conference on Electronic Packaging Technology (ICEPT) (01.08.2020)
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Conference Proceeding
Plasma treatment achieving enhanced thermal conductivity of a thermal interface material
Ma, Jiake, Wang, Yu, Gao, Ming, Ren, Linlin, Huang, Yifan, Sun, Rong
Published in 2019 20th International Conference on Electronic Packaging Technology(ICEPT) (01.08.2019)
Published in 2019 20th International Conference on Electronic Packaging Technology(ICEPT) (01.08.2019)
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Conference Proceeding