An EIRP Measurement Method of High-Power Microwave Systems Based on Near-Field Testing
Hu, Xianggang, Su, Jiancang, Zhang, Mingtao, Li, Xi, Ma, Dingkun, Gong, Jingang, Cheng, Kewei, Liu, Jia, Zhang, Jiande, Li, Rui, Cheng, Jie, Wu, Shaotong
Published in International journal of antennas and propagation (07.02.2024)
Published in International journal of antennas and propagation (07.02.2024)
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Journal Article
A novel method of interference source direction-finding with an existing single antenna beam in communication satellites
Ma, Dingkun, Li, Hao, Wu, Ruixue, Li, Yinan, Lü, Rongchuan, Ma, Yan, Ding, Yi, Yang, Xiaojiao, Jiang, Tong, Yu, Xumin
Published in Frontiers in physics (01.08.2023)
Published in Frontiers in physics (01.08.2023)
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Journal Article
Cu Clip-Bonding Method With Optimized Source Inductance for Current Balancing in Multichip SiC MOSFET Power Module
Wang, Laili, Zhang, Tongyu, Yang, Fengtao, Ma, Dingkun, Zhao, Cheng, Pei, Yunqing, Gan, Yongmei
Published in IEEE transactions on power electronics (01.07.2022)
Published in IEEE transactions on power electronics (01.07.2022)
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Journal Article
An Analytical Switching Loss Model for SiC MOSFET Considering Temperature-Dependent Reverse Recovery Over an Extremely Wide High-Temperature Range
Zhu, Mengyu, Pei, Yunqing, Yang, Fengtao, Cheng, Zizhen, Ma, Dingkun, Wang, Laili
Published in IEEE transactions on power electronics (01.06.2024)
Published in IEEE transactions on power electronics (01.06.2024)
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Journal Article
Investigation of Two High-Temperature Bipolar Phenomena and Characteristics of 1.2 kV SiC Power Diodes for High-Temperature Applications
Zhu, Mengyu, Pei, Yunqing, Yang, Fengtao, Xue, Zhe, Ma, Dingkun, Wang, Laili
Published in IEEE journal of emerging and selected topics in power electronics (01.02.2024)
Published in IEEE journal of emerging and selected topics in power electronics (01.02.2024)
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Journal Article
A Transient 3-D Thermal Modeling Method for IGBT Modules Considering Uneven Power Losses and Cooling Conditions
Wang, Jianpeng, Chen, Wenjie, Wang, Laili, Wang, Binyu, Zhao, Cheng, Ma, Dingkun, Yang, Fengtao, Li, Yan
Published in IEEE journal of emerging and selected topics in power electronics (01.08.2021)
Published in IEEE journal of emerging and selected topics in power electronics (01.08.2021)
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Journal Article
Smart Anomaly Prediction in Nonstationary CT Colonography Screening
Motai, Yuichi, Ma, Dingkun, Yoshida, Hiroyuki
Published in IEEE transactions on industrial informatics (01.12.2016)
Published in IEEE transactions on industrial informatics (01.12.2016)
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Journal Article
A Highly Integrated Multichip SiC MOSFET Power Module With Optimized Electrical and Thermal Performances
Ma, Dingkun, Xiao, Guochun, Zhang, Tongyu, Yang, Fengtao, Zhu, Mengyu, Yuan, Tianshu, Ma, Liangjun, Gan, Yongmei, Wang, Laili
Published in IEEE journal of emerging and selected topics in power electronics (01.04.2023)
Published in IEEE journal of emerging and selected topics in power electronics (01.04.2023)
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Journal Article
Air-Cooling System Optimization for IGBT Modules in MMC Using Embedded O-Shaped Heat Pipes
Wang, Binyu, Wang, Laili, Yang, Fengtao, Mu, Wei, Qin, Mengjie, Zhang, Fan, Ma, Dingkun, Wang, Jianpeng, Liu, Jinjun
Published in IEEE journal of emerging and selected topics in power electronics (01.08.2021)
Published in IEEE journal of emerging and selected topics in power electronics (01.08.2021)
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Journal Article
Support vector machines based composite kernel
Dingkun Ma, Xinquan Yang, Yin Kuang
Published in 2015 IEEE International Conference on Communication Problem-Solving (ICCP) (01.10.2015)
Published in 2015 IEEE International Conference on Communication Problem-Solving (ICCP) (01.10.2015)
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Conference Proceeding
A Comprehensive Study on Electric Field Coupling Effects of Medium-Voltage SiC Power Module and Optimization Design
Sun, Peiyuan, Wang, Laili, Yuan, Tianshu, Ma, Dingkun, Ma, Liangjun, Li, Lei, Guo, Jiacheng, Dong, Xiaobo, Gao, Kai
Published in 2024 IEEE Applied Power Electronics Conference and Exposition (APEC) (25.02.2024)
Published in 2024 IEEE Applied Power Electronics Conference and Exposition (APEC) (25.02.2024)
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Conference Proceeding
Design and Optimization of High Performance Gate Driver for Medium-Voltage SiC Power Modules
Li, Lei, Gan, Yongmei, Yuan, Tianshu, Ma, Dingkun, Nie, Yan, Sun, Peiyuan, Dong, Xiaobo, Gao, Kai, Wang, Laili
Published in 2024 IEEE Applied Power Electronics Conference and Exposition (APEC) (25.02.2024)
Published in 2024 IEEE Applied Power Electronics Conference and Exposition (APEC) (25.02.2024)
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Conference Proceeding
Structure and the Thermal Management of a 3-D Silicon Carbide MOSFET Module
Gao, Kai, Wang, Lai Li, Ma, Ding Kun, Yuan, Tian Shu, Nie, Yan, Xiao, Guo Chun, Ma, Liang Jun
Published in Key engineering materials (31.07.2023)
Published in Key engineering materials (31.07.2023)
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Journal Article
Research and Implement of Digital Receiver
Dingkun Ma, Xiaomin Zhang, Jian Luo
Published in 2010 International Conference on Signal Acquisition and Processing (01.02.2010)
Published in 2010 International Conference on Signal Acquisition and Processing (01.02.2010)
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Conference Proceeding
An Accurate and Effective Spice Model of 6.5kV SiC MOSFET with Parasitic Parameters Analysis in Medium-Voltage Power Module
Xie, Jiarun, Wang, Laili, Sun, Peiyuan, Ma, Dingkun, Yuan, Tianshu, Li, Lei, Ma, Liangjun, Li, Shiyan
Published in 2024 IEEE 10th International Power Electronics and Motion Control Conference (IPEMC2024-ECCE Asia) (17.05.2024)
Published in 2024 IEEE 10th International Power Electronics and Motion Control Conference (IPEMC2024-ECCE Asia) (17.05.2024)
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Conference Proceeding
A Novel Substrate-Baseplate Structure for Medium Voltage SiC MOSFET Device
Ma, Dingkun, Xiao, Guochun, Li, Lei, Yuan, Tianshu, Sun, Peiyuan, Guo, Jiacheng, Gao, Kai, Wang, Laili
Published in 2024 IEEE 7th International Electrical and Energy Conference (CIEEC) (10.05.2024)
Published in 2024 IEEE 7th International Electrical and Energy Conference (CIEEC) (10.05.2024)
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Conference Proceeding
Comparative Evaluation of 10 kV SiC MOSFET Power Module Insulation Ability Through Chip Neighborhood Range Electric Field Modelling
Sun, Peiyuan, Wang, Laili, Yuan, Tianshu, Ma, Dingkun, Chen, Qiling, Ma, Liangjun, Li, Lei, Ding, Peiyang
Published in 2024 IEEE 7th International Electrical and Energy Conference (CIEEC) (10.05.2024)
Published in 2024 IEEE 7th International Electrical and Energy Conference (CIEEC) (10.05.2024)
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Conference Proceeding
Electric Field Optimization for Enhanced Insulation in 10kV SiC MOSFET Power Modules Based on Chipwall Integration
Yuan, Tianshu, Jia, Lixin, Sun, Peiyuan, Chen, Qiling, Ma, Dingkun, Li, Lei, Gao, Kai, Wang, Laili
Published in 2024 IEEE 7th International Electrical and Energy Conference (CIEEC) (10.05.2024)
Published in 2024 IEEE 7th International Electrical and Energy Conference (CIEEC) (10.05.2024)
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Conference Proceeding
A Double-sided Flip chip SiC Power Module with a Novel Flip Chip Method On DBC By PTFE Coating
Ma, Liangjun, Zhang, Hong, Li, Lei, Yuan, Tianshu, Ma, Dingkun, Yao, Yilong, Gao, Kai, Wang, Laili
Published in 2023 IEEE Energy Conversion Congress and Exposition (ECCE) (29.10.2023)
Published in 2023 IEEE Energy Conversion Congress and Exposition (ECCE) (29.10.2023)
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Conference Proceeding
An Adjacent Miller Clamp Circuit for Crosstalk Suppression in SiC MOSFETs
Nie, Yan, Ma, Dingkun, Yuan, Tianshu, Yang, Junhui, Cui, Hongchang, Ma, Liangjun, Li, Lei, Wang, Laili
Published in 2023 IEEE Energy Conversion Congress and Exposition (ECCE) (29.10.2023)
Published in 2023 IEEE Energy Conversion Congress and Exposition (ECCE) (29.10.2023)
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Conference Proceeding