Microstructural Indicators for Prognostication of Copper-Aluminum Wire Bond Reliability Under High-Temperature Storage and Temperature Humidity
Lall, Pradeep, Deshpande, Shantanu, Luu Nguyen, Murtuza, Masood
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.04.2016)
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.04.2016)
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Journal Article
Reliability of lead-free SAC electronics under simultaneous exposure to high temperature and vibration
Lall, P., Limaye, G., Suhling, J., Murtuza, M., Palmer, B., Cooper, W.
Published in 13th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (01.05.2012)
Published in 13th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (01.05.2012)
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Conference Proceeding
SECURE ENCLAVE SYSTEM-IN-PACKAGE
LINDER, Peter Robert, WELSH, Erik James, LEE, William Arthur Fitzhugh, MURTUZA, Masood
Year of Publication 29.08.2024
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Year of Publication 29.08.2024
Patent
Secure enclave system-in-package
Welsh, Erik James, Murtuza, Masood, Linder, Peter Robert, Lee, William Arthur Fitzhugh
Year of Publication 04.06.2024
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Year of Publication 04.06.2024
Patent