Semiconductor device having a conductive film on an inner wall of a through hole
Yoshida, Hiroshi, Ishibashi, Hidetoshi, Murata, Daisuke, Kitabayashi, Takuya
Year of Publication 10.05.2022
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Year of Publication 10.05.2022
Patent
Direct Power Board Bonding Technology for 3D Power Module Package
Ishibashi, Hidetoshi, Yoshida, Hiroshi, Murata, Daisuke, Morisaki, Shota, Rokubuichi, Hodaka, Minamide, Ayumi, Asaji, Nobuhiro
Published in 2019 International Conference on Electronics Packaging (ICEP) (01.04.2019)
Published in 2019 International Conference on Electronics Packaging (ICEP) (01.04.2019)
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Conference Proceeding
Semiconductor device and electric power conversion apparatus
Yoshida, Hiroshi, Ishibashi, Hidetoshi, Murata, Daisuke, Kitabayashi, Takuya
Year of Publication 29.09.2020
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Year of Publication 29.09.2020
Patent
Semiconductor apparatus, method for manufacturing the same and electric power conversion device
Yoshida, Hiroshi, Ishibashi, Hidetoshi, Murata, Daisuke, Kitabayashi, Takuya
Year of Publication 08.09.2020
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Year of Publication 08.09.2020
Patent
SEMICONDUCTOR DEVICE
ISHIBASHI, Hidetoshi, KITABAYASHI, Takuya, YOSHIDA, Hiroshi, MURATA, Daisuke
Year of Publication 23.07.2020
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Year of Publication 23.07.2020
Patent
Vehicle cooling system
Hiraoka, Naoki, Asai, Takashi, Takahashi, Kenro, Murata, Daisuke, Yasuda, Tomohiro, Ozawa, Tomoya, Kobayashi, Keita
Year of Publication 19.04.2022
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Year of Publication 19.04.2022
Patent
SEMICONDUCTOR DEVICE AND ELECTRIC POWER CONVERSION APPARATUS
ISHIBASHI, Hidetoshi, YOSHIDA, Hiroshi, KITABAYASHI, Takuya, MURATA, Daisuke
Year of Publication 12.03.2020
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Year of Publication 12.03.2020
Patent
Semiconductor device and power conversion device
Kaji, Yusuke, Yoshida, Hiroshi, Kondo, Satoshi, Murata, Daisuke, Asada, Shinsuke
Year of Publication 25.02.2020
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Year of Publication 25.02.2020
Patent