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Year of Publication 08.09.2022
Patent
LAYERED BONDING MATERIAL, SEMICONDUCTOR PACKAGE, AND POWER MODULE
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Year of Publication 30.09.2021
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Year of Publication 30.09.2021
Patent
금속체, 끼워 맞춤형 접속 단자, 및 금속체의 형성 방법
IWAMOTO HIROYUKI, TSUCHIYA MASATO, TSURUTA KAICHI, NAKAMURA KATSUJI, MUNEKATA OSAMU, KONDOH SHIGEKI
Year of Publication 29.09.2022
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Year of Publication 29.09.2022
Patent
METAL BODY, FITTING-TYPE CONNECTION TERMINAL, AND METAL BODY FORMING METHOD
KONDOH Shigeki, IWAMOTO Hiroyuki, TSUCHIYA Masato, MUNEKATA Osamu, TSURUTA Kaichi, NAKAMURA Katsuji
Year of Publication 26.08.2021
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Year of Publication 26.08.2021
Patent
Study on External Stress Type Whisker and Crystal Orientation for Sn Plated Film
IWAMOTO, Hiroyuki, NAKAMURA, Katsuji, MUNEKATA, Osamu, YOSHIHARA, Sachio
Published in Hyōmen gijutsu (01.12.2021)
Published in Hyōmen gijutsu (01.12.2021)
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Journal Article