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"MULLEN, III; WILLIAM B"
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"MULLEN, III; WILLIAM B"
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METHOD FOR EFFECTING SOLDER INTERCONNECTS
by
HENDRICKS, DOUGLAS W
,
MULLEN III
,
WILLIAM B
Year of Publication
11.03.1993
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METHOD OF MAKING HIGH DENSITY SOLDER BUMPS AND A SUBSTRATE SOCKET FOR HIGH DENSITY SOLDER BUMPS
by
FLAUGHER, JILL L
,
MULLEN III
,
WILLIAM B
,
ALTMAN, LEONARD F
,
SHUPLESA, ANTHONY B
Year of Publication
28.01.1994
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ELECTRICAL SOCKET APPARATUS WITH TEMPORARY HOUSING
by
MULLEN
,
WILLIAM B
.,
III
Year of Publication
09.07.1991
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Electrical socket apparatus with temporary housing
by
MULLEN
,
III
;
WILLIAM B
Year of Publication
07.11.1989
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SINGLE ALLOY SOLDER CLAD SUBSTRATE
by
BANERJI, KINGSHUK
,
BRADLEY, EDWIN, L., III
,
MULLEN
,
WILLIAM
,
B
.,
III
Year of Publication
10.10.2001
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Moisture enhanced ball grid array package
by
MULLEN
,
III WILLIAM B
,
GOLD GLENN E
,
MILES BARRY M
Year of Publication
05.06.2001
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SINGLE ALLOY SOLDER CLAD SUBSTRATE
by
BANERJI, KINGSHUK
,
BRADLEY, EDWIN, L., III
,
MULLEN
,
WILLIAM
,
B
.,
III
Year of Publication
06.05.1999
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TACKING AGENT
by
MULLEN
,
WILLIAM
,
B
.,
III
,
SUPPELSA, ANTHONY, B
,
PENNISI, ROBERT, W
Year of Publication
10.06.1998
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Method for effecting solder interconnects
by
HENDRICKS; DOUGLAS W
,
MULLEN
,
III
;
WILLIAM B
Year of Publication
26.12.1989
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SINGLE ALLOY SOLDER CLAD SUBSTRATE
by
BANERJI, KINGSHUK
,
BRADLEY, EDWIN, L., III
,
MULLEN
,
WILLIAM
,
B
.,
III
Year of Publication
01.10.1997
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Single alloy solder clad substrate
by
BRADLEY, III; EDWIN L
,
MULLEN
,
III
;
WILLIAM B
,
BANERJI; KINGSHUK
Year of Publication
22.04.1997
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SELECTIVELY RELEASING CONDUCTIVE RUNNER AND SUBSTRATE ASSEMBLY
by
MULLEN
,
WILLIAM B
.
III
,
SUPPELSA, ANTHONY B
,
URBISH, GLEEN F
Year of Publication
31.01.1997
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Selectively releasing conductive runner and substrate assembly
by
GLENN F URBISH
,
WILLIAM B MULLEN III
,
ANTHONY B SUPPELSA
Year of Publication
24.07.1996
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SINGLE ALLOY SOLDER CLAD SUBSTRATE
by
BANERJI, KINGSHUK
,
BRADLEY, EDWIN, L., III
,
MULLEN
,
WILLIAM
,
B
.,
III
Year of Publication
06.06.1996
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High density electrical lead
by
URBISH; GLENN F
,
MULLEN
,
III
;
WILLIAM B
Year of Publication
08.07.1986
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Chip carrier having copper pattern plated with gold on one surface and devoid of gold on another surface
by
URBISH; GLENN F
,
MULLEN
,
III
;
WILLIAM B
,
BANERJI; KINGSHUK
Year of Publication
29.08.1995
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Method of making a substrate having selectively releasing conductive runners
by
URBISH; GLENN F
,
MULLEN
,
III
;
WILLIAM B
,
SUPPELSA; ANTHONY B
Year of Publication
16.08.1994
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INTEGRATED CIRCUIT CHIP CARRIER
by
BANERJI, KINGSHUK
,
THOMPSON, KENNETH, R
,
MULLEN
,
WILLIAM
,
B
.,
III
Year of Publication
08.06.1994
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19
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Backplane grounding for flip-chip integrated circuit
by
MULLEN
,
III
;
WILLIAM B
,
NOUNOU; FADIA
,
BANERJI; KINGSHUK
Year of Publication
10.05.1994
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Leadless pad array chip carrier
by
GLENN F URBISH
,
WILLIAM B
.
MULLEN III
,
BRUCE J FREYMAN
Year of Publication
31.03.1994
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