Improvement in Chemical Resistance of Positive-tone Photodefinable Poly(benzoxazole) Materials
Kotani, Masashi, Ohe, Masayuki, Motobe, Takeharu, Nakamura, Yuki, Taku, Konno, Minegishi, Tomonori, Ono, Keishi
Published in Journal of Photopolymer Science and Technology (01.01.2010)
Published in Journal of Photopolymer Science and Technology (01.01.2010)
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Journal Article
Study on Adhesion Improvement of Polyimide Film
Katoh, Kohji, Motobe, Takeharu, Ohe, Masayuki, Soejima, Kazuya, Kaneya, Yuichi, Tanaka, Toshiaki, Itabashi, Toshiaki
Published in Journal of Photopolymer Science and Technology (01.01.2009)
Published in Journal of Photopolymer Science and Technology (01.01.2009)
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Journal Article
New Polyimides Coating Technology for Next Generation Semiconductor Application
Katoh, Kohji, Ohe, Masayuki, Komatsu, Hiroshi, Motobe, Takeharu, Hattori, Takashi, Ueno, Takumi
Published in ECS transactions (27.04.2007)
Published in ECS transactions (27.04.2007)
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Journal Article
PHOTOSENSITIVE RESIN COMPOSITION AND PRODUCTION METHOD OF PATTERNED CURED FILM USING THE SAME
ONO TAKASHI, MOTOBE TAKEHARU, NAKAMURA YUKI, OE TADAYUKI, MINEGISHI TOMONORI, MATSUYA NORITAKA
Year of Publication 03.08.2015
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Year of Publication 03.08.2015
Patent
Highly Reliable Photosensitive Negative-Tone Polyimide with Low Cure Shrinkage
Matsukawa, Daisaku, Yotsuyanagi, Hiroko, Sakakibara, Shiori, Yamazaki, Noriyuki, Enomoto, Tetsuya, Motobe, Takeharu
Published in 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) (01.05.2019)
Published in 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) (01.05.2019)
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Conference Proceeding
Recent progress in low temperature curable photosensitive dielectrics
Enomoto, Tetsuya, Abe, Satoshi, Matsukawa, Daisaku, Nakamura, Tadamitsu, Yamazaki, Noriyuki, Saito, Nobuyuki, Ohe, Masayuki, Motobe, Takeharu
Published in 2017 International Conference on Electronics Packaging (ICEP) (01.04.2017)
Published in 2017 International Conference on Electronics Packaging (ICEP) (01.04.2017)
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Conference Proceeding
Evaluation of fan-out wafer level package using 200 °C curable positive-tone photodefinable polybenzoxazoles
Nishimura, Masato, Toba, Masaya, Matsuie, Noritaka, Motobe, Takeharu, Ohe, Masayuki
Published in 2015 IEEE CPMT Symposium Japan (ICSJ) (01.11.2015)
Published in 2015 IEEE CPMT Symposium Japan (ICSJ) (01.11.2015)
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Conference Proceeding
Novel 200 degC curable positive tone poly(benzoxazole) materials
Matsukawa, Daisaku, Nakamura, Tadamitsu, Enomoto, Tetsuya, Yamazaki, Noriyuki, Ohe, Masayuki, Motobe, Takeharu, Nishimura, Masato
Published in 2016 IEEE CPMT Symposium Japan (ICSJ) (01.11.2016)
Published in 2016 IEEE CPMT Symposium Japan (ICSJ) (01.11.2016)
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Conference Proceeding