Smart conducting polymer composites having zero temperature coefficient of resistance
Chu, Kunmo, Lee, Sung-Chul, Lee, Sangeui, Kim, Dongearn, Moon, Changyoul, Park, Sung-Hoon
Published in Nanoscale (14.01.2015)
Published in Nanoscale (14.01.2015)
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Journal Article
Si via interconnection technique for 3D MEMS package
Jinwoo Jeong, Hyeon Cheol Kim, Kukjin Chun, Eunsung Lee, Changyoul Moon
Published in 2006 5th IEEE Conference on Sensors (01.10.2006)
Published in 2006 5th IEEE Conference on Sensors (01.10.2006)
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Conference Proceeding
Smart conducting polymer composites having zero temperature coefficient of resistanceElectronic supplementary information (ESI) available: Normalized resistance as a function of increasing temperature for CNTs with different aspect ratios, other configurations of the bi-layered composite with the corresponding circuit diagrams, an SEM image of the CNT/PDMS composite with low resolution and dependence of DC conductivity on the number of three roll passes, numerically calculated normalized resista
Chu, Kunmo, Lee, Sung-Chul, Lee, Sangeui, Kim, Dongearn, Moon, Changyoul, Park, Sung-Hoon
Year of Publication 11.12.2014
Year of Publication 11.12.2014
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Journal Article
Low Temperature, Wafer Level Au-In Bonding for ISM Packaging
Qian Wang, Kyudong Jung, Minseog Choi, Woonbae Kim, Sukjin Ham, Byunggil Jeong, Changyoul Moon
Published in 2006 7th International Conference on Electronic Packaging Technology (01.08.2006)
Published in 2006 7th International Conference on Electronic Packaging Technology (01.08.2006)
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Conference Proceeding
Fabrication and MFM study of 60 nm track-pitch discrete track media
Sohn, Jin-Seung, Lee, Duhyun, Cho, Eunhyoung, Kim, Hae-Sung, Sul, SangChul, Lee, Byung-Kyu, Lee, MyungBok, Moon, Changyoul, Park, No-Cheol
Published in Nanotechnology (21.01.2011)
Published in Nanotechnology (21.01.2011)
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Journal Article
Application of Au-Sn eutectic bonding in hermetic RF MEMS wafer level packaging
KIM, Woonbae, QIAN WANG, JUNG, Kyudong, HWANG, Junsik, MOON, Changyoul
Published in 9th International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces (IEEE Cat. No.04TH8742). 2004 Proceedings (2004)
Published in 9th International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces (IEEE Cat. No.04TH8742). 2004 Proceedings (2004)
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Conference Proceeding
Si Via Interconnection Technique with Thermal Budget Design
Jinwoo, Jeong, Eunsung, Lee, Hyeon Cheol, Kim, Changyoul, Moon, Kukjin, Chun
Published in 2007 International Conference on Thermal Issues in Emerging Technologies: Theory and Application (01.01.2007)
Published in 2007 International Conference on Thermal Issues in Emerging Technologies: Theory and Application (01.01.2007)
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Conference Proceeding
Microstructure of AuSn Wafer Bonding for RF-MEMS Packaging
Jian Cai, Qian Wang, Xiaogang Li, Woonbae Kim, Shuidi Wang, Junsik Hwang, Changyoul Moon
Published in 2005 6th International Conference on Electronic Packaging Technology (2005)
Published in 2005 6th International Conference on Electronic Packaging Technology (2005)
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Conference Proceeding
A low temperature, hermetic wafer level packaging method for RF MEMS switch
Woonbae Kim, Qian Wang, Junsik Hwang, Moonchul Lee, Kyudong Jung, SukJin Ham, Changyoul Moon, Kyedong Baeks, Byeoungju Ha, Insang Song
Published in Proceedings Electronic Components and Technology, 2005. ECTC '05 (2005)
Published in Proceedings Electronic Components and Technology, 2005. ECTC '05 (2005)
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Conference Proceeding
A morphology-independent wafer level rivet packaging with Lego-like assembly
Eunsung Lee, Woonbae Kim, Insang Song, Changyoul Moon, Moon Koo Kang, Hyeon Cheol Kim, Kukjin Chun
Published in The 13th International Conference on Solid-State Sensors, Actuators and Microsystems, 2005. Digest of Technical Papers. TRANSDUCERS '05 (2005)
Published in The 13th International Conference on Solid-State Sensors, Actuators and Microsystems, 2005. Digest of Technical Papers. TRANSDUCERS '05 (2005)
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Conference Proceeding
Semiconductor devices and methods of manufacturing the same
Kim Yongsung, Moon Changyoul, Wenxu Xianyu, Park Yongyoung, Lee Jooho, Lee Jeongyub, Yang Wooyoung
Year of Publication 01.08.2017
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Year of Publication 01.08.2017
Patent
Wafer Level Lateral Bonding Scheme with LEGO-Like Structure
Lee, Eunsung, Kim, Woonbae, Song, Insang, Moon, Changyoul, Kim, Hyeon Cheol, Kang, Moon Koo, Choi, Soon-Don, Chun, Kukjin
Published in Sensors and materials (01.01.2005)
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Published in Sensors and materials (01.01.2005)
Journal Article
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING THE SAME
MOON Changyoul, WENXU Xianyu, YANG Wooyoung, PARK Yongyoung, LEE Jooho, KIM Yongsung, LEE Jeongyub
Year of Publication 25.08.2016
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Year of Publication 25.08.2016
Patent