Toward System on Chip (SoC) Development Using FinFET Technology: Challenges, Solutions, Process Co-Development & Optimization Guidelines
Shrivastava, M, Mehta, R, Gupta, S, Agrawal, N, Baghini, M S, Sharma, D K, Schulz, T, Arnim, K, Molzer, W, Gossner, H, Rao, V R
Published in IEEE transactions on electron devices (01.06.2011)
Published in IEEE transactions on electron devices (01.06.2011)
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Journal Article
Evaluation of process parameter space of bulk FinFETs using 3D TCAD
Nawaz, Muhammad, Decker, Stefan, Giles, Luis-Felipe, Molzer, Wolfgang, Schulz, Thomas
Published in Microelectronic engineering (01.07.2008)
Published in Microelectronic engineering (01.07.2008)
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Journal Article
HIGH CONDUCTIVITY HIGH FREQUENCY VIA FOR ELECTRONIC SYSTEMS
MUELLER CHRISTIAN, BARTH HANS JOACHIM, MOLZER WOLFGANG, MAHNKOPF REINHARD, GOSSNER HARALD
Year of Publication 03.02.2016
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Year of Publication 03.02.2016
Patent
Validation of 30 nm process simulation using 3D TCAD for FinFET devices
Nawaz, Muhammad, Molzer, Wolfgang, Haibach, Patrick, Landgraf, Erhard, Roesner, Wolfgang, Staedele, Martin, Luyken, Hannes, Gencer, Alp
Published in Semiconductor science and technology (01.08.2006)
Published in Semiconductor science and technology (01.08.2006)
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Journal Article
Thermal issues in test: An overview of the significant aspects and industrial practice
Alt, J., Bernardi, P., Bosio, A., Cantoro, R., Kerkhoff, H., Leininger, A., Molzer, W., Motta, A., Pacha, C., Pagani, A., Rohani, A., Strasser, R.
Published in 2016 IEEE 34th VLSI Test Symposium (VTS) (23.05.2016)
Published in 2016 IEEE 34th VLSI Test Symposium (VTS) (23.05.2016)
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Conference Proceeding
Journal Article
INTEGRATED CIRCUIT PACKAGES HAVING REDUCED Z-HEIGHT AND HEAT PATH
Wagner, Thomas, Proschwitz, Jan, Prasad, Vishnu, Koller, Sonja, Molzer, Wolfgang
Year of Publication 05.10.2023
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Year of Publication 05.10.2023
Patent
INTEGRATED CIRCUIT PACKAGES HAVING REDUCED Z-HEIGHT
Wagner, Thomas, Proschwitz, Jan, Prasad, Vishnu, Koller, Sonja, Molzer, Wolfgang
Year of Publication 21.09.2023
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Year of Publication 21.09.2023
Patent
On the thermal failure in nanoscale devices: Insight towards heat transport including critical BEOL and design guidelines for robust thermal management & EOS/ESD reliability
Shrivastava, M, Agrawal, M, Aghassi, J, Gossner, H, Molzer, W, Schulz, T, Ramgopal Rao, V
Published in 2011 International Reliability Physics Symposium (01.04.2011)
Published in 2011 International Reliability Physics Symposium (01.04.2011)
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Conference Proceeding
SUBSTRATE FOR IMPROVED HEAT DISSIPATION AND METHOD
Hanna, Carlton, Reif, Stefan, Talebbeydokhti, Pouya, Stoeckl, Stephan, Seidemann, Georg, Molzer, Wolfgang
Year of Publication 28.09.2023
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Year of Publication 28.09.2023
Patent
MICROELECTRONIC ASSEMBLIES INCLUDING STIFFENERS AROUND INDIVIDUAL DIES
Wagner, Thomas, Gowda, Mohan Prashanth Javare, Talebbeydokhti, Pouya, Stoeckl, Stephan, Koller, Sonja, Molzer, Wolfgang
Year of Publication 21.09.2023
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Year of Publication 21.09.2023
Patent
PACKAGING ARCHITECTURE WITH REINFORCEMENT STRUCTURE IN PACKAGE SUBSTRATE
Wagner, Thomas, Gowda, Mohan Prashanth Javare, Talebbeydokhti, Pouya, Stoeckl, Stephan, Koller, Sonja, Molzer, Wolfgang
Year of Publication 24.08.2023
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Year of Publication 24.08.2023
Patent
PACKAGING ARCHITECTURE WITH REINFORCEMENT STRUCTURE IN PACKAGE SUBSTRATE
Wagner, Thomas, Gowda, Mohan Prashanth Javare, Talebbeydokhti, Pouya, Stoeckl, Stephan, Koller, Sonja, Molzer, Wolfgang
Year of Publication 24.08.2023
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Year of Publication 24.08.2023
Patent
TRANSFORMERS BASED ON BURIED POWER RAIL TECHNOLOGY
Herold, Klaus, Wagner, Thomas, Baumgartner, Peter, Langenbuch, Michael, Waidhas, Bernd, Singer, Joachim, Molzer, Wolfgang
Year of Publication 22.06.2023
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Year of Publication 22.06.2023
Patent
BACK SIDE POWER SUPPLY FOR ELECTRONIC DEVICES
MOLZER, Wolfgang, HEROLD, Klaus, BAUMGARTNER, Peter, WAGNER, Thomas, LANGENBUCH, Michael, SINGER, Joachim, WAIDHAS, Bernd
Year of Publication 14.06.2023
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Year of Publication 14.06.2023
Patent
Back Side Power Supply for Electronic Devices
MOLZER, Wolfgang, HEROLD, Klaus, BAUMGARTNER, Peter, WAGNER, Thomas, LANGENBUCH, Michael, SINGER, Joachim, WAIDHAS, Bernd
Year of Publication 30.03.2023
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Year of Publication 30.03.2023
Patent
BACK SIDE POWER SUPPLY FOR ELECTRONIC DEVICES
MOLZER, Wolfgang, HEROLD, Klaus, BAUMGARTNER, Peter, WAGNER, Thomas, LANGENBUCH, Michael, SINGER, Joachim, WAIDHAS, Bernd
Year of Publication 29.03.2023
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Year of Publication 29.03.2023
Patent