Transient liquid phase bonding for solder-a short review
Saud, Norainiza, Said, Rita Mohd
Published in IOP conference series. Materials Science and Engineering (01.12.2019)
Published in IOP conference series. Materials Science and Engineering (01.12.2019)
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Journal Article
Enhanced thermal and microstructure properties of Sn-1.0Ag-0.7Cu based lead-free solder with Titanium Oxide addition
Said, Rita Mohd, Saud, Norainiza, Nasir, Norhayanti Mohd, Salleh, Mohd Arif Anuar Mohd, Derman, Mohd Nazree, Ramli, Mohd Izrul Izwan
Published in IOP conference series. Materials Science and Engineering (01.12.2019)
Published in IOP conference series. Materials Science and Engineering (01.12.2019)
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Journal Article
Effect of surface finish on the wettability and electrical resistivity of Sn-3.0Ag-0.5Cu solder
Amli, Siti Farahnabilah Muhd, Salleh, Mohd Arif Anuar Mohd, Said, Rita. Mohd, Razak, Nurul Razliana Abdul, Wahab, Juyana A., Ramli, Mohd Izrul Izwan
Published in IOP conference series. Materials Science and Engineering (01.12.2019)
Published in IOP conference series. Materials Science and Engineering (01.12.2019)
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Journal Article
An Investigation of TiO2 Addition on Microstructure Evolution of Sn-Cu-Ni Solder Paste Composite
Norainiza Saud, Rita Mohd Said, Mohd Arif Anuar Mohd Salleh, Derman, Mohd Nazree, Mohd Izrul Izwan Ramli, Norhayanti Mohd Nasir
Published in MATEC Web of Conferences (01.01.2016)
Published in MATEC Web of Conferences (01.01.2016)
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Conference Proceeding
Journal Article
Mixed Assembly of Lead-free Solder Joint: A Short Review
Said, Rita Mohd, Salleh, Mohd Arif Anuar Mohd, Ramli, Mohd Izrul Izwan, Saud, Norainiza, Somidin, Flora, Razak, Nurul Razliana Abdul, Ismail, Anis Nadhirah
Published in Journal of physics. Conference series (01.01.2022)
Published in Journal of physics. Conference series (01.01.2022)
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Journal Article
Microstructure Study of Mix Assembly Lead-free Sn-Ag-Cu Ball Grid Array and Sn-10Cu Solder Paste
Said, Rita Mohd, Sulwarajan, Kalaiarasi A/P, Razak, Nurul Razliana Abdul, Somidin, Flora, Zaimi, Nur Syahirah Muhammad
Published in Journal of physics. Conference series (01.01.2022)
Published in Journal of physics. Conference series (01.01.2022)
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Journal Article
Performance of Sn-3.0Ag-0.5Cu Composite Solder with Kaolin Geopolymer Ceramic Reinforcement on Microstructure and Mechanical Properties under Isothermal Ageing
Zaimi, Nur Syahirah Mohamad, Salleh, Mohd Arif Anuar Mohd, Sandu, Andrei Victor, Abdullah, Mohd Mustafa Al Bakri, Saud, Norainiza, Rahim, Shayfull Zamree Abd, Vizureanu, Petrica, Said, Rita Mohd, Ramli, Mohd Izrul Izwan
Published in Materials (07.02.2021)
Published in Materials (07.02.2021)
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Journal Article
Influence of 1.5 wt.% Bi on the Microstructure, Hardness, and Shear Strength of Sn-0.7Cu Solder Joints after Isothermal Annealing
Ramli, Mohd Izrul Izwan, Salleh, Mohd Arif Anuar Mohd, Sandu, Andrei Victor, Amli, Siti Farahnabilah Muhd, Said, Rita Mohd, Saud, Norainiza, Abdullah, Mohd Mustafa Al Bakri, Vizureanu, Petrica, Rylski, Adam, Chaiprapa, Jitrin, Nabialek, Marcin
Published in Materials (07.09.2021)
Published in Materials (07.09.2021)
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Journal Article
MICROSTRUCTURE AND INTERFACIAL INTERMETALLIC OF Sn-3.0Ag-0.5Cu/Sn-58Bi SOLDER JOINT FOR PACKAGE-ON-PACKAGE TECHNOLOGY
RAMLI, Mohd Izrul Izwan, MOHD SAID, Rita, SOMIDIN, Flora, MUHD AMLI, Siti Farahnabilah, MUSTAPHA, Siti Nor Atirah
Published in European Journal of Materials Science and Engineering (Online) (20.06.2023)
Published in European Journal of Materials Science and Engineering (Online) (20.06.2023)
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Journal Article
Growth Kinetic of Sn-0.7Cu-0.05Ni Solder Paste Subjected to Isothermal Aging
Ramli, Mohd Izrul Izwan, Saud, Norainiza, Said, Rita Mohd, Mohd Salleh, Mohd Arif Anuar
Published in Solid state phenomena (27.08.2018)
Published in Solid state phenomena (27.08.2018)
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Journal Article
The Effect of Thermal Annealing on the Microstructure and Mechanical Properties of Sn-0.7Cu-xZn Solder Joint
Ramli, Mohd Izrul Izwan, Salleh, Mohd Arif Anuar Mohd, Said, Rita Mohd, Abdullah, Mohd Mustafa Al Bakri, Halin, Dewi Suriyani Che, Saud, Norainiza, Nabiałek, Marcin
Published in Metals (Basel ) (01.03.2021)
Published in Metals (Basel ) (01.03.2021)
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Journal Article
Influence of Non-Metallic Particles Addition on Wettability, Intermetallic Compound Formation and Microhardness of Sn-0.7Cu Lead Free Solder Paste
Mohd Salleh, Mohd Arif Anuar, Al Bakri, A.M. Mustafa, Saud, Norainiza, Said, Rita Mohd, Zaimi, N.S. Mohamad
Published in Solid state phenomena (27.08.2018)
Published in Solid state phenomena (27.08.2018)
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Journal Article
The Effect of Micron-Size Silicon Additions on Microstructure, Microhardness and Thermal Properties of Sn-Cu-Ni Solder Alloy
Saud, Norainiza, Said, Rita Mohd, Izwan Ramli, Mohd Izrul, Derman, Mohd Nazree, Nasir, Norhayanti, Mohd Salleh, Mohd Arif Anuar
Published in Materials science forum (10.06.2015)
Published in Materials science forum (10.06.2015)
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Journal Article
Microstructure, Interfacial IMC and Wettability of Sn-0.7Cu-xZn Solder Alloy
Ramli, Mohd Izrul Izwan, Mohd Salleh, Mohd Arif Anuar, Said, Rita Mohd, Ibrahim, I.N.A.
Published in Solid state phenomena (27.08.2018)
Published in Solid state phenomena (27.08.2018)
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Journal Article