Advances in Dry Etch Processing for High-Density Vertical Interconnects in Fan-Out Panel-Level Packaging and IC Substrates
Schein, Friedrich-Leonhard, Elghazzali, Mohammed, Voigt, Christian, Tsigaras, Ioannis, Sawamoto, Hirofumi, Strolz, Ewald, Rettenmeier, Roland, Bottcher, Lars
Published in 2021 IEEE 71st Electronic Components and Technology Conference (ECTC) (01.06.2021)
Published in 2021 IEEE 71st Electronic Components and Technology Conference (ECTC) (01.06.2021)
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