Thermal stress analysis under thermal cycling test for SiC power device heat dissipation structures using Ag sintered layer
Osonoe, Kensuke, Aoki, Masaaki, Mochizuki, Akihiro, Murakami, Yoshio, Kida, Hitoshi, Yoshinari, Goro, Nakano, Nobuhiko
Published in 2017 International Conference on Electronics Packaging (ICEP) (01.04.2017)
Published in 2017 International Conference on Electronics Packaging (ICEP) (01.04.2017)
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