Direct Patterning of Silver Circuit Using Surface- modification and UV Irradiation on Polyimide Resin
Nawafune, Hidemi, Nishioka, Taro, Mizumoto, Shozo, Seita, Masaru, Imanari, Masaaki, Kanai, Toshinobu
Published in Transactions of the Institute of Metal Finishing (2002)
Published in Transactions of the Institute of Metal Finishing (2002)
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Journal Article
Electrodeposition of Sn-Ag Eutectic Alloy from Methanesulfonate Bath
NAWAFUNE, Hidemi, SHIBA, Kazuhiro, MIZUMOTO, Shozo, TAKEUCHI, Takao, AOKI, Kazuhiro
Published in Hyōmen gijutsu (01.12.2000)
Published in Hyōmen gijutsu (01.12.2000)
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Journal Article
Electrodeposition of Void-free Copper from Ethylenediamine Complex Bath for ULSI Metallization
NAWAFUNE, Hidemi, KITAMURA, Hiroshi, MIZUMOTO, Shozo, UCHIDA, Ei, OKADA, Takashi
Published in Hyōmen gijutsu (01.11.2000)
Published in Hyōmen gijutsu (01.11.2000)
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Journal Article
Electrodeposition of Sn-Cu Alloy from Methanesulfonate Bath
NAWAFUNE, Hidemi, IKEDA, Kazuki, SHIBA, Kazuhiro, MIZUMOTO, Shozo, TAKEUCHI, Takao, AOKI, Kazuhiro
Published in Hyōmen gijutsu (01.10.1999)
Published in Hyōmen gijutsu (01.10.1999)
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Journal Article
Autocatalytic Electroless Silver Deposition Using 2-Aminoethanethiol as Reducing Agent
NAWAFUNE, Hidemi, SHIROGUCHI, Keiko, TANIKUBO, Masato, MIZUMOTO, Shozo, KOHASHI, Yasuhito, TAKEUCHI, Takao
Published in Hyōmen gijutsu (01.10.1999)
Published in Hyōmen gijutsu (01.10.1999)
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Journal Article
Electrodeposition of Copper from Ethylenediamine Complex Bath for ULSI Metallization
NAWAFUNE, Hidemi, KITAMURA, Hiroshi, MIZUMOTO, Shozo, UCHIDA, Ei, OKADA, Takashi
Published in Hyōmen gijutsu (01.07.1999)
Published in Hyōmen gijutsu (01.07.1999)
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Journal Article
Deposition Mechanism of Electroless Pd Plating Using Formic Acid as a Reducing Agent
UCHIDA, Ei, OKADA, Takashi, NAWAFUNE, Hidemi, NAKAO, Seiichiro, MIZUMOTO, Shozo
Published in Hyōmen gijutsu (01.05.1999)
Published in Hyōmen gijutsu (01.05.1999)
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Journal Article
Fabrication of Ultra-large Scale Integrated by Electroless Neutral Copper Plating
NAWAFUNE, Hidemi, NAKAO, Seiichiro, MIZUMOTO, Shozo, MURAKAMI, Yosiki, HASIMOTO, Sin
Published in Hyōmen gijutsu (01.04.1999)
Published in Hyōmen gijutsu (01.04.1999)
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Journal Article
Fabrication of Ultra-large Scale Integrated Circuits by Electroless Copper Plating System
NAWAFUNE, Hidemi, NAKAO, Seiichiro, MIZUMOTO, Shozo, MURAKAMI, Yoshiki, HASHIMOTO, Shin
Published in Hyōmen gijutsu (01.12.1998)
Published in Hyōmen gijutsu (01.12.1998)
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Journal Article
Deposition Mechanism of Electroless Ni-Cu-P Alloy Plating
NAWAFUNE, Hidemi, UEGAKI, Takashi, MIZUMOTO, Shozo, ISHIKAWA, Masami, NAKAMURA, Tsuneshi
Published in Hyōmen gijutsu (01.04.1997)
Published in Hyōmen gijutsu (01.04.1997)
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Journal Article
Crystal Structure of Electroless Palladium Plating Films Using Trimethylamine Borane as a Reducing Agent
HAGA, Masaki, UCHIDA, Ei, NAWAFUNE, Hidemi, KAMIURA, Yuuki, MIZUMOTO, Shozo
Published in Hyōmen gijutsu (01.04.1996)
Published in Hyōmen gijutsu (01.04.1996)
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Journal Article
Crystal Structure and Properties of Electrodeposited Palladium-Nickel-Phosphorus Alloy
MIZUMOTO, Shozo, NAWAFUNE, Hidemi, OKADA, Takashi, HAGA, Masaki
Published in Hyōmen gijutsu (01.01.1994)
Published in Hyōmen gijutsu (01.01.1994)
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