High-efficiency planarization method combining mechanical polishing and atmospheric-pressure plasma etching for hard-to-machine semiconductor substrates
SANO, Yasuhisa, SHIOZAWA, Kousuke, DOI, Toshiro, KUROKAWA, Syuhei, AIDA, Hideo, MIYASHITA, Tadakazu, YAMAUCHI, Kazuto
Published in Mechanical Engineering Journal (01.01.2016)
Published in Mechanical Engineering Journal (01.01.2016)
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Journal Article
Building of super high-efficiency processing technology based on innovative concept (Establishment of effective polishing process of SiC substrate using Dilatancy pad tool with bowl feed method)
DOI, Toshiro K., SESHIMO, Kiyoshi, YAMAZAKI, Tsutomu, OHTSUBO, Masanori, NISHIZAWA, Hideaki, MURAKAMI, Sachi, ICHIKAWA, Daizo, NAKAMURA, Yoshio, MIYASHITA, Tadakazu, KAWAMURA, Yoshihide, TAKAGI, Masataka, KASHIWADA, Hiroshi, AIDA, Hideo
Published in Kikai Gakkai ronbunshū = Transactions of the Japan Society of Mechanical Engineers (2015)
Published in Kikai Gakkai ronbunshū = Transactions of the Japan Society of Mechanical Engineers (2015)
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Journal Article
Proposal of Magnetic-Force-Assisted Polishing Method
Wada, Tatsuyuki, Uneda, Michio, Yamamoto, Yuko, Miyashita, Tadakazu, Ishikawa, Ken-ichi
Published in ECS journal of solid state science and technology (01.05.2024)
Published in ECS journal of solid state science and technology (01.05.2024)
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Journal Article
Real-Time Prediction of Removal Rate and Friction Coefficient During Chemical Mechanical Polishing Using Motor Load Currents with a Polisher
Uneda, Michio, Ota, Shunpei, Takiguchi, Shunsuke, Yamamoto, Yuko, Miyashita, Tadakazu, Ishikawa, Ken-ichi
Published in ECS journal of solid state science and technology (01.01.2023)
Published in ECS journal of solid state science and technology (01.01.2023)
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Journal Article
Hybrid Effect Study of Pad-Conditioning/Slurry-Supply by High-Pressure-Micro-Jet (HPMJ) Method during CMP Process
Wang, Chengwu, Doi, Toshiro, Miyachi, Keiji, Tsukamoto, Keiichi, Miyashita, Tadakazu, Kurokawa, Syuhei, Fan, Li, Zhang, Yu, Hang, Wei
Published in ECS journal of solid state science and technology (09.03.2020)
Published in ECS journal of solid state science and technology (09.03.2020)
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Journal Article
Development of basic-type CMP/P-CVM fusion processing system (Type A) and its fundamental characteristics
Shiozawa, Kousuke, Sano, Yasuhisa, Kurokawa, Syuhei, Miyashita, Tadakazu, Sumizawa, Haruo, Doi, Toshiro, Aida, Hideo, Oyama, Koki, Yamauchi, Kazuto
Published in Proceedings of International Conference on Planarization/CMP Technology 2014 (01.11.2014)
Published in Proceedings of International Conference on Planarization/CMP Technology 2014 (01.11.2014)
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Conference Proceeding
Smart Polishing of Hard-to-Machine Materials with an Innovative Dilatancy Pad under High-Pressure, High-Speed, Immersed Condition
Doi, Toshiro K., Seshimo, Kiyoshi, Yamazaki, Tsutomu, Ohtsubo, Masanori, Ichikawa, Daizo, Miyashita, Tadakazu, Takagi, Masataka, Saeki, Taku, Aida, Hideo
Published in ECS journal of solid state science and technology (01.01.2016)
Published in ECS journal of solid state science and technology (01.01.2016)
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Journal Article
POLISHING APPARATUS
OHTSUBO MASANORI, MIYASHITA TADAKAZU, SESHIMO KIYOSHI, ICHIKAWA DAIZO
Year of Publication 11.01.2017
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Year of Publication 11.01.2017
Patent
WORK PROCESSING APPARATUS
AIDA, Hideo, KAJIKURA, Atsushi, DOI, Toshiro, TAKEDA, Hidetoshi, MIYASHITA, Tadakazu
Year of Publication 22.09.2022
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Year of Publication 22.09.2022
Patent
POLISHING APPARATUS
KOBAYASHI, SYUICHI, KITAGAWA, KOJI, UENO, JUNICHI, KUDO, HIDEO, KAJIKURA, ATSUSHI, NISHIMOTO, YOSHINOBU, MIYASHITA, TADAKAZU
Year of Publication 04.09.2008
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Year of Publication 04.09.2008
Patent
Proposal and development of a novel high-speed/high-pressure polishing machine aiming at the super high efficiency process of the hard-to-process substrates
Yamazaki, Tsutomu, Doi, Toshiro K., Ichikawa, Daizo, Seshimo, Kiyoshi, Miyashita, Tadakazu, Ohtsubo, Masanori
Published in Proceedings of International Conference on Planarization/CMP Technology 2014 (01.11.2014)
Published in Proceedings of International Conference on Planarization/CMP Technology 2014 (01.11.2014)
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Conference Proceeding
Optimization of machining conditions of basic-type CMP/P-CVM fusion processing using SiC substrate
Sano, Yasuhisa, Shiozawa, Kousuke, Doi, Toshiro, Kurokawa, Syuhei, Aida, Hideo, Oyama, Koki, Miyashita, Tadakazu, Sumizawa, Haruo, Yamauchi, Kazuto
Published in 2015 International Conference on Planarization/CMP Technology (ICPT) (01.09.2015)
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Published in 2015 International Conference on Planarization/CMP Technology (ICPT) (01.09.2015)
Conference Proceeding