Joining Interface of Plating and Solder
MIYAMA, Katsumi, SAITO, Shigeru
Published in Journal of The Surface Finishing Society of Japan (01.10.2021)
Published in Journal of The Surface Finishing Society of Japan (01.10.2021)
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Journal Article
Development of the file performance tester based on the shaper
YOSHIDA, Kanou, MIYAMA, Katsumi
Published in Journal of the Japan Society for Abrasive Technology (01.03.2023)
Published in Journal of the Japan Society for Abrasive Technology (01.03.2023)
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Journal Article
Fabrication of Artificial Delamination Flaw Specimens and an Application of Active Thermography
MIYAMA, Katsumi, YOSHIDA, Kanou, OKUMURA, Mitsunori, SAKURABA, Yohei, TANAKA, Hiroyuki, AIYAMA, Hideaki
Published in Hi-hakai kensa (01.07.2020)
Published in Hi-hakai kensa (01.07.2020)
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Journal Article
Effects of external bending stress on device-embedded substrate
Miyama, Katsumi, Katoh, Yoshihisa
Published in 2017 International Conference on Electronics Packaging (ICEP) (01.04.2017)
Published in 2017 International Conference on Electronics Packaging (ICEP) (01.04.2017)
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Conference Proceeding
Fabrication of Fine Copper Structure on Both Sides by Thermal Nanoimprint
SAITOU, Takayuki, KATAYAMA, Naoki, MIYAMA, Katsumi, YAJIMA, Masaki, WATANABE, Hideo
Published in Hyōmen gijutsu (01.09.2015)
Published in Hyōmen gijutsu (01.09.2015)
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Journal Article