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Redistribution Layer Defect Classification Using Computer Vision Techniques And Machine Learning

by Dangayach, Sachin, Lianto, Prayudi, Mishra, Satwik Swarup
Published in 2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC) (02.12.2020)

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Conference Proceeding

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POST BONDING AOI DEFECT CLASSIFICATION

by LIM, Yin Wei, KOMATIREDDI, Rahul Reddy, CHENG, Khor Wui, CHERIKKALLIL, Rohith, CHAN, Si En, SUO, Peng, MISHRA, Satwik Swarup, MALLAVARAM, Krishnaprasad Reddy, KONGARA, Sneha Rupa, DANGAYACH, Sachin, LIANTO, Prayudi, KOH, Remus Zhen Hui
Year of Publication 03.10.2024

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Patent

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AUTOMATION METHOD FOR DEFECT CHARACTERIZATION FOR HYBRID BONDING APPLICATION

by LIM, Yin Wei, KOMATIREDDI, Rahul Reddy, CHENG, Khor Wui, CHERIKKALLIL, Rohith, CHAN, Si En, SUO, Peng, MALLAVARAM, Krishnaprasad Reddy, MISHRA, Satwik Swarup, KONGARA, Sneha Rupa, DANGAYACH, Sachin, LIANTO, Prayudi, KOH, Remus Zhen Hui
Year of Publication 03.10.2024

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Patent

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PRE-BONDING AUTOMATIC OPTICAL INSPECTION DEFECT CLASSIFICATION

by LIM, Yin Wei, KOMATIREDDI, Rahul Reddy, CHENG, Khor Wui, CHERIKKALLIL, Rohith, CHAN, Si En, SUO, Peng, MISHRA, Satwik Swarup, MALLAVARAM, Krishnaprasad Reddy, KONGARA, Sneha Rupa, DANGAYACH, Sachin, LIANTO, Prayudi, KOH, Remus Zhen Hui
Year of Publication 03.10.2024

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Patent

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DEFECT CLASSIFICATION OF PROCESSED WAFERS

by LIM, Yin Wei, KOMATIREDDI, Rahul Reddy, CHENG, Khor Wui, CHERIKKALLIL, Rohith, CHAN, Si En, SUO, Peng, MISHRA, Satwik Swarup, MALLAVARAM, Krishnaprasad Reddy, KONGARA, Sneha Rupa, DANGAYACH, Sachin, LIANTO, Prayudi, KOH, Remus Zhen Hui
Year of Publication 03.10.2024

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Patent

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PRE-BONDING AUTOMATIC OPTICAL INSPECTION DEFECT CLASSIFICATION

by LIM, Yin Wei, KOMATIREDDI, Rahul Reddy, CHENG, Khor Wui, CHERIKKALLIL, Rohith, CHAN, Si En, SUO, Peng, MISHRA, Satwik Swarup, MALLAVARAM, Krishnaprasad Reddy, KONGARA, Sneha Rupa, DANGAYACH, Sachin, LIANTO, Prayudi, KOH, Remus Zhen Hui
Year of Publication 03.10.2024

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Patent

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AUTOMATION METHOD FOR DEFECT CHARACTERIZATION FOR HYBRID BONDING APPLICATION

by LIM, Yin Wei, KOMATIREDDI, Rahul Reddy, CHENG, Khor Wui, CHERIKKALLIL, Rohith, CHAN, Si En, SUO, Peng, MALLAVARAM, Krishnaprasad Reddy, MISHRA, Satwik Swarup, KONGARA, Sneha Rupa, DANGAYACH, Sachin, LIANTO, Prayudi, KOH, Remus Zhen Hui
Year of Publication 03.10.2024

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Patent

Redistribution Layer Defect Classification Using Computer Vision Techniques And Machine Learning

POST BONDING AOI DEFECT CLASSIFICATION

AUTOMATION METHOD FOR DEFECT CHARACTERIZATION FOR HYBRID BONDING APPLICATION

PRE-BONDING AUTOMATIC OPTICAL INSPECTION DEFECT CLASSIFICATION

DEFECT CLASSIFICATION OF PROCESSED WAFERS

PRE-BONDING AUTOMATIC OPTICAL INSPECTION DEFECT CLASSIFICATION

AUTOMATION METHOD FOR DEFECT CHARACTERIZATION FOR HYBRID BONDING APPLICATION

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