SILICA POWDER IN WHICH AGGREGATION IS REDUCED, RESIN COMPOSITION, AND SEMICONDUCTOR SEALING MATERIAL
HAYASHI, Naoto, AIKYO, Teruhiro, MINAMIKAWA, Takaaki, HATAYAMA, Yasuaki
Year of Publication 01.08.2024
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Year of Publication 01.08.2024
Patent
Silica powder in which aggregation is reduced, resin composition, and semiconductor sealing material
AIKYO, TERUHIRO, HATAYAMA, YASUAKI, MINAMIKAWA, TAKAAKI, HAYASHI, NAOTO
Year of Publication 16.01.2023
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Year of Publication 16.01.2023
Patent