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"MILNE, JASON G"
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"MILNE, JASON G"
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집적 회로 및 디바이스 레벨 냉각을 위한 마이크로-호스
by
MILNE JASON G
Year of Publication
12.02.2018
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DIE ENCAPSULATION IN OXIDE BONDED WAFER STACK
by
MILNE JASON G
,
DRAB JOHN J
Year of Publication
29.12.2020
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산화물 본딩된 웨이퍼 스택 내에서의 다이 캡슐화
by
MILNE JASON G
,
DRAB JOHN J
Year of Publication
05.11.2019
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금속 라디에이터의 고주파 폴리머
by
MILNE JASON G
,
ISOM ROBERT S
,
MARQUETTE ANDREW J
Year of Publication
23.05.2019
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능동 전자 주사 배열(AESA)을 위한 타일
by
MILNE JASON G
,
DRAB JOHN J
,
ROLSTON KEVIN C
,
TESHIBA MARY A
Year of Publication
03.05.2019
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RF MODULE FOR INDIVIDUAL OR INTEGRATED USE
by
MILNE JASON G
,
DOMINSKI FREDERICK A
,
GIANVITTORIO JOHN P
Year of Publication
16.11.2015
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STACKED WAFER WITH COOLANT CHANNELS
by
MILNE JASON G
,
KOONTZ CHRISTOPHER R
,
WONG TSE E
Year of Publication
27.10.2015
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Micro-hoses for integrated circuit and device level cooling
by
Milne
,
Jason G
Year of Publication
01.05.2018
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MICRO-HOSES FOR INTEGRATED CIRCUIT AND DEVICE LEVEL COOLING
by
MILNE
,
Jason G
Year of Publication
11.04.2018
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DIE ENCAPSULATION IN OXIDE BONDED WAFER STACK
by
MILNE
,
JASON G
,
DRAB, JOHN J
Year of Publication
08.12.2020
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Die encapsulation in oxide bonded wafer stack
by
Drab, John J
,
Milne
,
Jason G
Year of Publication
22.09.2020
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MICRO-HOSES FOR INTEGRATED CIRCUIT AND DEVICE LEVEL COOLING
by
MILNE
,
Jason G
Year of Publication
09.02.2017
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MICRO-HOSES FOR INTEGRATED CIRCUIT AND DEVICE LEVEL COOLING
by
MILNE
,
Jason G
Year of Publication
08.12.2016
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MICRO-HOSES FOR INTEGRATED CIRCUIT AND DEVICE LEVEL COOLING
by
Milne Jason G
Year of Publication
08.12.2016
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DIE ENCAPSULATION IN OXIDE BONDED WAFER STACK
by
DRAB, John J
,
MILNE
,
Jason G
Year of Publication
25.03.2020
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METHOD OF CREATING A COOLANT CHANNEL IN A SEMICONDUCTOR WAFER ASSEMBLY
by
WONG, Tse E
,
MILNE
,
Jason G
,
KOONTZ, Christopher R
Year of Publication
03.11.2021
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Die package having security features
by
George, Aaron
,
Kehl, Jason M
,
Milne
,
Jason G
,
Mayrose, Steve F
Year of Publication
27.06.2023
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DIE ENCAPSULATION IN OXIDE BONDED WAFER STACK
by
DRAB, John J
,
MILNE
,
Jason G
Year of Publication
27.09.2019
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DIE ENCAPSULATION IN OXIDE BONDED WAFER STACK
by
Drab, John J
,
Milne
,
Jason G
Year of Publication
18.07.2019
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DIE PACKAGE HAVING SECURITY FEATURES
by
George, Aaron
,
Kehl, Jason M
,
Milne
,
Jason G
,
Mayrose, Steve F
Year of Publication
15.12.2022
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