Search Results - "MIGNOT YANN" :: K.UTB vyhledávací portál | TBU Library Retrieval Portal

국부화된 금속 실리사이드를 포함한 랩-어라운드 컨택

국부화된 금속 실리사이드를 포함한 랩-어라운드 컨택

by GREENE ANDREW M, MILLER ERIC, MIGNOT YANN, FROUGIER JULIEN
Year of Publication 27.06.2023

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Patent

A review of the mechanical stressors efficiency applied to the ultra-thin body & buried oxide fully depleted silicon on insulator technology

A review of the mechanical stressors efficiency applied to the ultra-thin body & buried oxide fully depleted silicon on insulator technology

by Morin, Pierre, Maitrejean, Sylvain, Allibert, Frederic, Augendre, Emmanuel, Liu, Qing, Loubet, Nicolas, Grenouillet, Laurent, Pofelski, Alexandre, Chen, Kangguo, Khakifirooz, Ali, Wacquez, Romain, Reboh, Shay, Bonnevialle, Aurore, le Royer, Cyrille, Morand, Yves, Kanyandekwe, Joel, Chanemougamme, Daniel, Mignot, Yann, Escarabajal, Yann, Lherron, Benoit, Chafik, Fadoua, Pilorget, Sonia, Caubet, Pierre, Vinet, Maud, Clement, Laurent, Desalvo, Barbara, Doris, Bruce, Kleemeier, Walter
Published in Solid-state electronics (01.03.2016)

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Journal Article

56 nm pitch Cu dual-damascene interconnects with self-aligned via using negative-tone development Lithography-Etch-Lithography-Etch patterning scheme

56 nm pitch Cu dual-damascene interconnects with self-aligned via using negative-tone development Lithography-Etch-Lithography-Etch patterning scheme

by LOQUET, Yannick, MIGNOT, Yann, MORRIS, Bryan, KLEEMEIER, Walter, LINIGER, E, SPOONER, Terry, WASKIEWICZ, Christopher, CHEN, James Hsueh-Chung, SANKARAPANDIAN, Muthumanickam, CHEN, Shyng-Tsong, FLAITZ, Philip, TOMIZAWA, Hideyuki, TSENG, Chia-Hsun, BEARD, Marcy
Published in Microelectronic engineering (01.07.2013)

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Conference Proceeding Journal Article

56nm pitch Cu dual-damascene interconnects with self-aligned via using negative-tone development Lithography-Etch-Lithography-Etch patterning scheme

56nm pitch Cu dual-damascene interconnects with self-aligned via using negative-tone development Lithography-Etch-Lithography-Etch patterning scheme

by Loquet, Yannick, Mignot, Yann, Waskiewicz, Christopher, Chen, James Hsueh-Chung, Sankarapandian, Muthumanickam, Chen, Shyng-Tsong, Flaitz, Philip, Tomizawa, Hideyuki, Tseng, Chia-Hsun, Beard, Marcy, Morris, Bryan, Kleemeier, Walter, Liniger, E., Spooner, Terry
Published in Microelectronic engineering (01.07.2013)

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Journal Article

Skip-via proximity interconnect

Skip-via proximity interconnect

by Chen, Hsueh-Chung, Mignot, Yann
Year of Publication 07.03.2023

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Patent

FULLY ALIGNED VIA TO SINGLE DAMASCENE UPPER TRENCH

FULLY ALIGNED VIA TO SINGLE DAMASCENE UPPER TRENCH

by Mignot, Yann, Motoyama, Koichi, Park, Chanro
Year of Publication 19.09.2024

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Patent

Back-end-of-line single damascene top via spacer defined by pillar mandrels

Back-end-of-line single damascene top via spacer defined by pillar mandrels

by Xu, Yongan, Chen, Hsueh-Chung, Mignot, Yann
Year of Publication 17.09.2024

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Patent

BEOL INTERCONNECTS WITH IMPROVED ISOLATION BY SUB-DIVISION OF INLAID CONDUCTORS

BEOL INTERCONNECTS WITH IMPROVED ISOLATION BY SUB-DIVISION OF INLAID CONDUCTORS

by PARK, Chanro, MIGNOT, Yann, CHEN, Hsueh-Chung
Year of Publication 01.05.2024

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Patent

Spacer image transfer with double mandrel

Spacer image transfer with double mandrel

by Xu, Yongan, Mignot, Yann
Year of Publication 21.04.2020

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Patent

BACK-END-OF-LINE SINGLE DAMASCENE TOP VIA SPACER DEFINED BY PILLAR MANDRELS

BACK-END-OF-LINE SINGLE DAMASCENE TOP VIA SPACER DEFINED BY PILLAR MANDRELS

by Chen, Hsueh-Chung, Mignot, Yann, Xu, YONGAN
Year of Publication 16.03.2023

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Patent

ASYMMETRIC GATE CONTACT OVER SOURCE/DRAIN CONTACT

ASYMMETRIC GATE CONTACT OVER SOURCE/DRAIN CONTACT

by Xie, Ruilong, Mignot, Yann, Siddiqui, Shahab, Park, Chanro
Year of Publication 03.10.2024

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Patent

SPACER IMAGE TRANSFER WITH DOUBLE MANDREL

SPACER IMAGE TRANSFER WITH DOUBLE MANDREL

by Xu, Yongan, Mignot, Yann
Year of Publication 17.10.2019

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Patent

Via cleaning to reduce resistance

Via cleaning to reduce resistance

by Yang, Chih-Chao, Mignot, Yann A. M
Year of Publication 17.01.2023

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Patent

BEOL INTERCONNECTS WITH IMPROVED ISOLATION BY SUB-DIVISION OF INLAID CONDUCTORS

BEOL INTERCONNECTS WITH IMPROVED ISOLATION BY SUB-DIVISION OF INLAID CONDUCTORS

by PARK, Chanro, MIGNOT, Yann, CHEN, Hsueh-Chung
Year of Publication 29.12.2022

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Patent

SUBTRACTIVE METAL VIA WITH METAL BRIDGE

SUBTRACTIVE METAL VIA WITH METAL BRIDGE

by Arnold, John Christopher, Mignot, Yann, Motoyama, Koichi, Park, Chanro
Year of Publication 22.08.2024

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Patent

SUBTRACTIVE METAL ETCH WITH IMPROVED ISOLATION FOR BEOL INTERCONNECT AND CROSS POINT

SUBTRACTIVE METAL ETCH WITH IMPROVED ISOLATION FOR BEOL INTERCONNECT AND CROSS POINT

by Chen, Hsueh-Chung, PARK, CHANRO, Mignot, Yann
Year of Publication 22.12.2022

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Patent

Litho-litho-etch (LLE) multi color resist

Litho-litho-etch (LLE) multi color resist

by De Silva, Ekmini Anuja, Mignot, Yann, Goldfarb, Dario
Year of Publication 09.07.2024

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Patent

SKIP-VIA PROXIMITY INTERCONNECT

SKIP-VIA PROXIMITY INTERCONNECT

by Chen, Hsueh-Chung, Mignot, Yann
Year of Publication 18.03.2021

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Patent

Wrap-around projection liner for AI device

Wrap-around projection liner for AI device

by Silvestre, Mary Claire, Chen, Hsueh-Chung, Mignot, Yann, Ok, Injo
Year of Publication 11.06.2024

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Patent

MANDREL-PULL-FIRST INTERCONNECT PATTERNING

MANDREL-PULL-FIRST INTERCONNECT PATTERNING

by GHOSH, SOMNATH, Yang, Xiaoming, Mignot, Yann, Edelstein, Daniel Charles
Year of Publication 16.05.2024

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Patent

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