Power electronics cooling effectiveness versus thermal inertia
Meysenc, L., Jylhakallio, M., Barbosa, P.
Published in IEEE transactions on power electronics (01.05.2005)
Published in IEEE transactions on power electronics (01.05.2005)
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Journal Article
Suitability and optimization of high-voltage IGBTs for series connection with active voltage clamping
Bauer, F., Meysenc, L., Piazzesi, A.
Published in IEEE transactions on power electronics (01.11.2005)
Published in IEEE transactions on power electronics (01.11.2005)
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Journal Article
Double-sided cooling for high power IGBT modules using flip chip technology
Gillot, C., Schaeffer, C., Massit, C., Meysenc, L.
Published in IEEE transactions on components and packaging technologies (01.12.2001)
Published in IEEE transactions on components and packaging technologies (01.12.2001)
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Journal Article
Active Neutral-Point-Clamped Multilevel Converters
Barbosa, P., Steimer, P., Steinke, J., Meysenc, L., Winkelnkemper, M., Celanovic, N.
Published in 2005 IEEE 36th Power Electronics Specialists Conference (2005)
Published in 2005 IEEE 36th Power Electronics Specialists Conference (2005)
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Conference Proceeding
Integrated single and two-phase micro heat sinks under IGBT chips
Gillot, C., Meysenc, L., Schaeffer, C., Bricard, A.
Published in IEEE transactions on components and packaging technologies (01.09.1999)
Published in IEEE transactions on components and packaging technologies (01.09.1999)
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Journal Article
Double-sided cooling for high power IGBT modules using flip chip technology
Gillot, C., Schaeffer, C., Ferret, R., Massit, C., Meysene
Published in Conference Record of the 2000 IEEE Industry Applications Conference. Thirty-Fifth IAS Annual Meeting and World Conference on Industrial Applications of Electrical Energy (Cat. No.00CH37129) (2000)
Published in Conference Record of the 2000 IEEE Industry Applications Conference. Thirty-Fifth IAS Annual Meeting and World Conference on Industrial Applications of Electrical Energy (Cat. No.00CH37129) (2000)
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Conference Proceeding
A high heat flux IGBT micro exchanger setup
Meysenc, L., Saludjian, L., Bricard, A., Rael, S., Schaeffer, C.
Published in IEEE transactions on components, packaging, and manufacturing technology. Part A (01.09.1997)
Published in IEEE transactions on components, packaging, and manufacturing technology. Part A (01.09.1997)
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Journal Article
Physical Layout of High Current Rectifiers: Modern Methods for an Old Challenge
Schanen, J.L., Guichon, J.M., Domenech, C., Meysenc, L.
Published in 2008 IEEE Industry Applications Society Annual Meeting (01.10.2008)
Published in 2008 IEEE Industry Applications Society Annual Meeting (01.10.2008)
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Conference Proceeding