Strain mapping and simulation of transistor structures in a 22nm FDSOI technology
Utess, Dirk, Kleimaier, Dominik Martin, Billan, Etienne, Youssuf, Tashfain, Zhao, Zhixing, Nemec, Thorgund, Meyer, Moritz Andreas, Rinderknecht, Jochen
Published in BIO web of conferences (2024)
Published in BIO web of conferences (2024)
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Journal Article
Effect of interface strength on electromigration-induced inlaid copper interconnect degradation: Experiment and simulation
Zschech, Ehrenfried, Engelmann, Hans-Jürgen, Meyer, Moritz Andreas, Kahlert, Volker, Vairagar, Anand V., Mhaisalkar, Subodh G., Krishnamoorthy, Ahila, Yan, Minyu, Tu, K. N., Sukharev, Valeriy
Published in International journal of materials research (16.02.2022)
Published in International journal of materials research (16.02.2022)
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Journal Article
In situ SEM observation of electromigration phenomena in fully embedded copper interconnect structures
Meyer, M.A, Herrmann, M, Langer, E, Zschech, E
Published in Microelectronic engineering (01.10.2002)
Published in Microelectronic engineering (01.10.2002)
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Journal Article
Conference Proceeding
Challenges of electromigration
Zschech, Ehrenfried, Meyer, Moritz Andreas, Grafe, Marco, Schneider, Gerd
Published in Materialprüfung (01.10.2004)
Published in Materialprüfung (01.10.2004)
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Journal Article
Metal line layout based on line shifting
Lehr Matthias U, Hassmann Jens, Herrmann Thomas, Kuncha Rakesh Kumar, Meyer Moritz Andreas, Melde Thomas
Year of Publication 20.02.2018
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Year of Publication 20.02.2018
Patent
METAL LINE LAYOUT BASED ON LINE SHIFTING
Lehr Matthias U, Hassmann Jens, Herrmann Thomas, Kuncha Rakesh Kumar, Meyer Moritz Andreas, Melde Thomas
Year of Publication 17.08.2017
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Year of Publication 17.08.2017
Patent