Process Control and Physical Failure Analysis for Sub-100NM CU/Low-K Structures
Zschech, Ehrenfried, Huebner, Rene, Potapov, Pavel, Zienert, Inka, Meyer, Moritz Andreas, Chumakov, Dmytro, Geisler, Holm, Hecker, Michael, Engelmann, Hans-Juergen, Langer, Eckhard
Published in 2008 International Interconnect Technology Conference (01.06.2008)
Published in 2008 International Interconnect Technology Conference (01.06.2008)
Get full text
Conference Proceeding
Geometry and Microstructure Effect on EM-Induced Copper Interconnect Degradation
Zschech, E., Ho, P.S., Schmeisser, D., Meyer, M.A., Vairagar, A.V., Schneider, G., Hauschildt, M., Kraatz, M., Sukharev, V.
Published in IEEE transactions on device and materials reliability (01.03.2009)
Published in IEEE transactions on device and materials reliability (01.03.2009)
Get full text
Magazine Article